Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Ao Zhong"'
Autor:
Manzhi Li, Ao Zhong, Yifan Tang, Jinnuo Yu, Mengmeng Wu, Karthick Kumaran Munisamy Selvam, Dong Sun
Publikováno v:
Lipids in Health and Disease, Vol 23, Iss 1, Pp 1-15 (2024)
Abstract Background and objective Dyslipidemia is significantly more common in those with concurrent chronic kidney disease (CKD) and chronic heart failure (CHF). Sacubitril/valsartan has showcased its influence on both cardiac and renal functions, e
Externí odkaz:
https://doaj.org/article/fc23fcecc961455e9140a729976a0079
Publikováno v:
IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing, Vol 17, Pp 7738-7747 (2024)
Fine-grained radar target classification based on single-band, such as wideband or narrowband, poses challenges even when utilizing deep learning methods. Since different bands reflect distinct characteristics of the targets, we focus on the fine-gra
Externí odkaz:
https://doaj.org/article/b1cbc802ae404a9a9ba7ee363dabd945
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
Acta Tropica. 241:106870
Autor:
Guoping Zhang, Wen Liu, Tao Wang, Jinhui Li, Rong Sun, Qiang Liu, Ao Zhong, Daquan Yu, Jinshan Liu
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Polyimides (PIs) have been used in a wide spectrum of high-tech fields for their excellent thermal property, excellent mechanical property, extremely low dielectric constant, excellent low temperature resistance, low CTE and good chemical resistance.
Publikováno v:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Coefficient of thermal expansion (CTE) mismatch is one key issue for the reliability of the dielectric materials in the advanced package. Herein, a novel polyimide (PI) with low CTE is successfully prepared with the introduce benzoxazole and silicon-
Publikováno v:
Advanced Materials Interfaces. 9:2101745
Autor:
Liang Shan, Wen Liu, Jinshan Liu, Fangfang Niu, Rong Sun, Jinhui Li, Ao Zhong, Ching-Ping Wong, Guoping Zhang, Tao Wang
Publikováno v:
Composites Part B: Engineering. 228:109412
Low-temperature curable and low-dielectric polyimides (PIs) are required in wafer-level packaging (WLP) which is an advanced microelectronic packaging technology. Herein, a low-cost and multifunctional nanofiller (aminoquinoline-functionalized graphe
Autor:
Xu, Wen-Lin, Shen, Hui-Ling, Ao, Zhong-Fang, Chen, Bao-An, Xia, Wei, Gao, Feng, Zhang, Yong-Ning
Publikováno v:
In Leukemia Research 2006 30(4):407-413
Autor:
Ching-Ping Wong, Xinxiu Wu, Fei Han, Fangfang Niu, Ao Zhong, Rong Sun, Yun Chen, Jinhui Li, Guoping Zhang
Publikováno v:
RSC advances. 9(68)
Flexible strain sensors possess a great potential for applications in wearable electronic devices for human motion detection, health monitoring, implantable medical devices and so on. However, the development of highly sensitive strain sensors remain