Výsledky vyhledávání

Enabling Resist Processing Technologies for Advanced Packaging

Autor: Antun Peic, Paul Lindner, Thorsten Matthias, Johanna Bartl

Publikováno v: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000830-000862

The increasing adoption of advanced wafer-level packaging (WLP) technologies and high density interposer concepts clearly reflect the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, several

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4a4c57a231885fc33c273d56fc201ec2
https://doi.org/10.4071/2014dpc-tp22

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Real-Time Optical Waveguide Measurements of Dye Adsorption into Nanocrystalline TiO2 Films with Relevance to Dye-Sensitized Solar Cells

Autor: Daniel R. Staff, Laurence M. Peter, Alison B. Walker, Antun Peic, Bernhard Menges, Petra J. Cameron, Thomas Risbridger

Publikováno v: The Journal of Physical Chemistry C. 115:613-619

Optical waveguide spectroscopy has been used to study the real-time adsorption of ruthenium 535-bisTBA (N-719) dye in mesoporous nanocrystalline titanium dioxide films of the type used in dye-sensitized solar cells (DSCs). Porous titania films were p

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::14d2e65d29ed0f39e4099ca04994734d
https://doi.org/10.1021/jp109316j

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Vapor Sensitivity of Networked Gold Nanoparticle Chemiresistors: Importance of Flexibility and Resistivity of the Interlinkage

Autor: Josef Michl, Antun Peic, Tobias Vossmeyer, Akio Yasuda, Xudong Chen, Yvonne Joseph

Publikováno v: The Journal of Physical Chemistry C. 111:12855-12859

In this study we investigated the response behavior of chemiresistors made from differently interlinked networks of gold nanoparticles. Our results show that the degree of flexibility and conductivity of the interlinkage between the nanoparticles has

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::78382c0ea5020b9ef6fc52ba8f31cb9e
https://doi.org/10.1021/jp072053+

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Improving performance and reliability of 3D wafer level packaging with unique photoresist coating process

Autor: Antun Peic

Publikováno v: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

The increasing adoption of advanced wafer-level packaging (WLP) technologies and high-density interposer concepts clearly reflects the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, severa

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::486797a312af4619816a5c5f32c2906c
https://doi.org/10.1109/impact.2014.7048375

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