Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Antun Peic"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000830-000862
The increasing adoption of advanced wafer-level packaging (WLP) technologies and high density interposer concepts clearly reflect the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, several
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a4c57a231885fc33c273d56fc201ec2
https://doi.org/10.4071/2014dpc-tp22
https://doi.org/10.4071/2014dpc-tp22
Autor:
Daniel R. Staff, Laurence M. Peter, Alison B. Walker, Antun Peic, Bernhard Menges, Petra J. Cameron, Thomas Risbridger
Publikováno v:
The Journal of Physical Chemistry C. 115:613-619
Optical waveguide spectroscopy has been used to study the real-time adsorption of ruthenium 535-bisTBA (N-719) dye in mesoporous nanocrystalline titanium dioxide films of the type used in dye-sensitized solar cells (DSCs). Porous titania films were p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d2e65d29ed0f39e4099ca04994734d
https://doi.org/10.1021/jp109316j
https://doi.org/10.1021/jp109316j
Publikováno v:
The Journal of Physical Chemistry C. 111:12855-12859
In this study we investigated the response behavior of chemiresistors made from differently interlinked networks of gold nanoparticles. Our results show that the degree of flexibility and conductivity of the interlinkage between the nanoparticles has
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78382c0ea5020b9ef6fc52ba8f31cb9e
https://doi.org/10.1021/jp072053+
https://doi.org/10.1021/jp072053+
Autor:
Antun Peic
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The increasing adoption of advanced wafer-level packaging (WLP) technologies and high-density interposer concepts clearly reflects the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, severa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::486797a312af4619816a5c5f32c2906c
https://doi.org/10.1109/impact.2014.7048375
https://doi.org/10.1109/impact.2014.7048375
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2014, p11-36, 26p
Autor:
Wolfgang Knoll, Rigoberto C. Advincula
Very thin film materials have emerged as a highly interesting and useful quasi 2D-state functionality. They have given rise to numerous applications ranging from protective and smart coatings to electronics, sensors and display technology as well as
