Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Antardipan Pal"'
Autor:
Nasir Ali, Fabio Andrijauskas, P. Balakrishna Pillai, Mark Banash, B. Cao, Dominic Caracciolo, Daniel Casimir, J. Chen, Cristian V. Ciobanu, Vitor R. Coluci, Sócrates O. Dantas, M.M. De Souza, Olasunbo Farinre, E.J. Garboczi, Raul Garcia-Sanchez, M.K. Harbola, Ming Hu, Y.H. Ikuhara, Z. Ji, Sri Ranga Jai Likith, Miao-Ling Lin, L. Lindsay, Aolin Lu, Elisabeth Mansfield, Prabhakar Misra, A. Mookerjee, J. Myers, Antardipan Pal, Ravindra Pandey, T. Pandey, Lia Phillips, L. Rast, Richard Robinson, Nabanita Saikia, Shiyao Shan, Guojun Shang, P. Singh, Ping-Heng Tan, Vinod K. Tewary, K. Vishal, K. Wang, Shan Wang, Xiaoyu Wang, Huizhen Wu, Dennis D. Yau, Shuguo Yu, Naili Yue, Hongyan Zhang, Yong Zhang, Zhi Zheng, Chuan-Jian Zhong, Weilie Zhou, Y. Zhuang
Publikováno v:
Modeling, Characterization, and Production of Nanomaterials ISBN: 9780128199053
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3cfc88dcc855fa367e227be2a30a776
https://doi.org/10.1016/b978-0-12-819905-3.09992-9
https://doi.org/10.1016/b978-0-12-819905-3.09992-9
Publikováno v:
Modeling, Characterization, and Production of Nanomaterials ISBN: 9780128199053
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c680b76a93dd15b1939c05214e718195
https://doi.org/10.1016/b978-0-12-819905-3.00001-4
https://doi.org/10.1016/b978-0-12-819905-3.00001-4
Publikováno v:
Frontiers in Optics + Laser Science 2022 (FIO, LS).
Photonic integration is typically limited to the communication between electronic sub-systems on a chip. A novel approach to achieve single-functional-unit level integration of electronic and photonic components is proposed, illustrated by FET-LET hy
Publikováno v:
2021 IEEE Research and Applications of Photonics in Defense Conference (RAPID).
Chip level electronic-photonic integration faces multiple challenges: wavelength mismatch, energy-data rate, and cascadability and fan-out. A light effect transistor (LET) can offer opto-electronic hybridization at the component level, allowing Moore
Publikováno v:
Photonics Research. 9:1369
A broad range of technologies have been developed for the chip and wafer scale connections and integrations of photonic and electronic circuits, although major challenges remain for achieving the single-functional-unit-level integration of electronic
Publikováno v:
2017 1st International Conference on Electronics, Materials Engineering and Nano-Technology (IEMENTech).
This paper presents a topology which gives optimum performance in terms of operating frequency, speed of operation, power dissipation, Power Delay Product (PDP) and transistor count. The operation of the latch shown is controlled by the p-MOS and the