Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Anoop Karunan"'
Autor:
null Prerna, Nithya Ramalingam, Zaman Zaid Mulla, Archana Ganeshan, Ranjul Balakrishnan, Anoop Karunan
Publikováno v:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Publikováno v:
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
This paper presents a novel approach of inductive compensation technique that is used in High-Speed I/O (HSIO) packaging which helps in meeting the return loss spec at package pins.The standard technique that is being followed in package design to me