Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Annie Tzu-yu Huang"'
Autor:
Annie Tzu-yu Huang, 黃子瑜
90
We develop an easy, low cost, and low temperature optoelectrionic hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. Bonding characteristic of our design is investigated on three different setups: silicon-s
We develop an easy, low cost, and low temperature optoelectrionic hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. Bonding characteristic of our design is investigated on three different setups: silicon-s
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/94496176607047932915
Autor:
Ching-Yao Shih, Chien-Ying Chen, Hsueh-Hsing Lu, Zai-Xien Weng, Cheng-Liang Wang, Jia-Hua Lin, Yu-Hsin Lin, Chia-Hsing Liu, Yuan-Chen Chin, Chang Yu-Chen, Ching-Chieh Fu, Wei-Jen Su, Chung-Chia Chen, Chi-Shun Chan, Annie Tzu-yu Huang, Kuan-Heng Lin, Chien-Ming Ko, Meng-Ting Lee, Yi-Hong Chen
Publikováno v:
SID Symposium Digest of Technical Papers. 48:333-337
A foldable AMOLED display capable of enduring very severe folding and environmental impact was obtained using symmetric panel stacking (SPS) with an innovative design of color filter structure. The display was subjected to in-situ folding cycle under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c845137e133d15d334d252f226304df
https://doi.org/10.1002/sdtp.11595
https://doi.org/10.1002/sdtp.11595
Autor:
Annie Tzu-yu Huang, Wei-Jen Su, Yuan-Chen Chin, Yi-Hong Chen, Yu-Hsin Lin, Chia-Hsing Liu, Kuan-Heng Lin, Chi-Shun Chan, Chang Yu-Chen, Hsueh-Hsing Lu, Zai-Xien Weng, Chung-Chia Chen, Ching-Chieh Fu, Meng-Ting Lee, Ching-Yao Shih, Cheng-Liang Wang, Chien-Ying Chen, Jia-Hua Lin, Chien-Ming Ko
Publikováno v:
Journal of the Society for Information Display. 25:229-239
A foldable active-matrix organic light-emitting diode display capable of enduring very severe folding and environmental impact was obtained using symmetric panel stacking with an innovative design of color filter structure. The display was subjected
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab9f9762d2045410cd9d1f4b1e67424f
https://doi.org/10.1002/jsid.533
https://doi.org/10.1002/jsid.533
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
This paper provides a fundamental study of large area, fluxless bonding with three different solder systems Cu-Sn, Ag-In, and Ag-SnBi, which were pre-deposited in layered structures. The thickness of each individual layer was carefully designed such
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e21cd69bab8680dfe0745552fb70e58a
https://doi.org/10.1115/ipack2007-33197
https://doi.org/10.1115/ipack2007-33197