Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Ankit Kaul"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 426-432 (2024)
For the autonomous driving application, data movement has increased rapidly between a CMOS Image sensor (CIS) and the processor due to increase in image resolution. Advanced packaging techniques like 2.5D/3D integration have been proposed to reduce t
Externí odkaz:
https://doaj.org/article/f51cdfe358af48d99f3db361a0b14654
Autor:
Ankit Kaul, Yandong Luo, Xiaochen Peng, Madison Manley, Yuan-Chun Luo, Shimeng Yu, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Electron Devices. 70:485-492
Autor:
Md Obaidul Hossen, Ankit Kaul, Eriko Nurvitadhi, Mondira Deb Pant, Ravi Gutala, Aravind Dasu, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1824-1831
Publikováno v:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 12:445-457
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :261-287
Publikováno v:
IEEE Transactions on Electron Devices. 68:5598-5605
Emerging nonvolatile memory (eNVM)-based compute-in-memory (CIM) accelerators have been proven in silicon for machine learning at the macrolevel. To fully unleash the system-level benefits, the heterogeneous 3-D integration (H3D) using through-silico
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:974-982
Heterogeneous integration techniques such as 2.5-D system-in-packages (SiPs) present new challenges that include higher aggregate package power as well as increased thermal crosstalk between different chiplets due to their proximity. This creates the
Autor:
Aravind Dasu, Thomas E. Sarvey, Sreejith Kochupurackal Rajan, Gutala Ravi Prakash, Ankit Kaul, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:2393-2403
The 2.5-D integration is becoming a common method of tightly integrating heterogeneous dice with dense interconnects for efficient, high-bandwidth inter-die communication. While this tight integration improves performance, it also increases the chall
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).