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pro vyhledávání: '"Anitha, Helen L"'
Autor:
Bhat, KN, Gupta, Das A, Rao, PRS, Gupta, Das N, Bhattacharya, E, Sivakumar, K, Kumar, Vinoth V, Anitha, Helen L, Joseph, JD, Madhavi, SP, Natarajan, K
Publikováno v:
IndraStra Global.
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=issn23813652::c42481d618910dfd49d543b51bb3f634
https://igi.indrastra.com/items/show/184873
https://igi.indrastra.com/items/show/184873
