Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Anil Yuksel"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1932-1938
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aafc05f3b77905711968f83becbc8172
https://doi.org/10.1109/tcpmt.2022.3230044
https://doi.org/10.1109/tcpmt.2022.3230044
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1388-1393
Making photonic sintering of metal nanoparticles, a viable nanomanufacturing process for printed electronics requires an understanding of all of the parameters that lead to variability in the photonic sintering process. This article examines the effe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::721c3a5b86f504a96050fea7a0f6618f
https://doi.org/10.1109/tcpmt.2020.3005339
https://doi.org/10.1109/tcpmt.2020.3005339
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
High performance computing and data center design and infrastructure is vital for the efficient use of supercomputers for applications such as AI and Machine Learning. This work investigates the thermal/fluid characterization of a water-cooled modula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19d46e0a3e751f04285fe56876c2107b
https://doi.org/10.1109/itherm51669.2021.9503286
https://doi.org/10.1109/itherm51669.2021.9503286
Publikováno v:
Journal of Thermal Science and Engineering Applications. 13
Fabrication of micro- and nanoscale electronic components has become increasingly demanding due to device and interconnect scaling combined with advanced packaging and assembly for electronic, aerospace, and medical applications. Recent advances in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36ca5daf165a52e3db5f02db545fbf20
https://doi.org/10.1115/1.4047631
https://doi.org/10.1115/1.4047631
Autor:
Kaushik Subramanian, Daniel Eversole, Richard K. Harrison, Adela Ben-Yakar, Frederic Bourgeois, Anil Yuksel
Publikováno v:
Scientific Reports
Scientific Reports, Vol 10, Iss 1, Pp 1-16 (2020)
Scientific Reports, Vol 10, Iss 1, Pp 1-16 (2020)
Plasmonic Laser Nanosurgery (PLN) is a novel photomodification technique that exploits the near-field enhancement of femtosecond (fs) laser pulses in the vicinity of gold nanoparticles. While prior studies have shown the advantages of fs-PLN to modif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d387dd93017ff4062339d3925944ad24
https://doi.org/10.1038/s41598-020-68512-2
https://doi.org/10.1038/s41598-020-68512-2
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal management of high-speed electronics has become more challenging due to dramatic increase of power density in high-speed CPUs and GPUs and server size limitations in data center for next generation exascale high-performance computing. Water c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c59da420e25ca01304e8344ef2671fdf
https://doi.org/10.1109/itherm45881.2020.9190488
https://doi.org/10.1109/itherm45881.2020.9190488
Autor:
Zongqing Ren, Ercan M. Dede, Prabhakar R. Bandaru, Anil Yuksel, Jaeho Lee, Jae Choon Kim, Dan Oh
Publikováno v:
Journal of Electronic Packaging. 143
Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaa60acb7fbd447bb9f246c387eeb705
https://doi.org/10.1115/1.4047414
https://doi.org/10.1115/1.4047414
Autor:
Shurong Tian, Todd E. Takken, Chris Marroquin, Mark D. Schultz, Anil Yuksel, Mark K. Hoffmeyer, Vic Mahaney
Publikováno v:
Journal of Electronic Packaging. 143
A new era of computing has begun with the development of high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), and cognitive systems. Dramatic increases in the power density of the electronic components have led to th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0f1605eb6a0fd703bde247821a79c2a
https://doi.org/10.1115/1.4046847
https://doi.org/10.1115/1.4046847
Publikováno v:
Journal of Heat Transfer. 142
Nanoparticle heating due to laser irradiation is of great interest in electronic, aerospace, and biomedical applications. This paper presents a coupled electromagnetic-heat transfer model to predict the temperature distribution of multilayer copper n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d73812b9ad07379666886fa66098ec6d
https://doi.org/10.1115/1.4045731
https://doi.org/10.1115/1.4045731
Autor:
Joseph Peoples, Yu-Wei Hung, Xiangyu Li, Daniel Gallagher, Nathan Fruehe, Mason Pottschmidt, Cole Breseman, Conrad Adams, Anil Yuksel, James Braun, W. Travis Horton, Xiulin Ruan
Publikováno v:
Applied Energy. 310:118368
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::addd2fa49e791914cd90f6b1e7258d3f
https://doi.org/10.1016/j.apenergy.2021.118368
https://doi.org/10.1016/j.apenergy.2021.118368