Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Anil B. Lingambudi"'
Autor:
Anil B. Lingambudi, Janani Swaminathan, Trinadhachari Kosuru, Krishna Thangaraj, Gary A. Tressler, Steve Wilson, Tom Kroetsch, Navya Chaitanya Gogula, Preetham Raghavendra
Publikováno v:
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Spin Torque Transfer Magneto-resistive Random-Access Memory (STT-MRAM) is a type of non-volatile memory that stores data in magnetic domains. It is a very interesting market space that STT-MRAM will support, trying to take the best of both worlds, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01ca86ab85a411c1528a4d91330d3d99
https://doi.org/10.1109/edaps50281.2020.9312911
https://doi.org/10.1109/edaps50281.2020.9312911
Publikováno v:
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
POWER9 processors are the current generation IBM POWER processors supporting direct-attached memory on the POWER series server systems. The POWER9 processors supports Industry Standard Registered Dual In-line Memory Modules (IS-RDIMM) running with Do
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42d1aa951e4b83732dda617464cc87d5
https://doi.org/10.1109/edaps.2018.8680887
https://doi.org/10.1109/edaps.2018.8680887
Publikováno v:
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
DIMMs built with DDR4 (Double Data Rate 4th-generation) SDRAM (Synchronous Dynamic Random-Access Memory) are the current memory components used on HPC (High Performance Computing) systems. The DDR4 signal interfaces operate up to a 3200 Mbps data rat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::718b9a8b4d39aa7563f1ab87c0a7c4c3
https://doi.org/10.1109/edaps.2016.7893123
https://doi.org/10.1109/edaps.2016.7893123
Publikováno v:
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Optimization of memory power is an important design objective in any computer device. However, servers are especially a challenge because the number of DRAMs are large and in aggregate can consume up to 40% of the overall system power. This paper pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::240cc366c2e4324c44306c6d32b9d9b1
https://doi.org/10.1109/edaps.2015.7383705
https://doi.org/10.1109/edaps.2015.7383705
Autor:
Saravanan Sethuraman, Anil B. Lingambudi, Dale Becker, Kyu-hyoun Kim, Abhijit Saurabh, Kenneth L. Wright
Publikováno v:
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
JEDEC DDR4 SDRAM adopted the internal Data (DQ) reference voltage (VREFDQ) generation scheme as opposed to DDR3 SDRAM where VREF was generated by an external device that produced fixed (constant) voltage irrespective of the loading on the device, pow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::685cd0968b21accc3afad1091b22db1c
https://doi.org/10.1109/edaps.2014.7030810
https://doi.org/10.1109/edaps.2014.7030810
Autor:
Siddharth Vijay, Abhijit Saurabh, Anil B. Lingambudi, Saravanan Sethuraman, Sivaram Pullelli, William Mark Zevin, Kenneth L. Wright
Publikováno v:
2014 Annual IEEE India Conference (INDICON).
Memory plays a significant role in successful operations of modern day servers. DDR3 memory has been around for a while and the next generation is almost available. There are lots of challenges which still exist and are not fully uncovered with the D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63c1720402dd5f47780c8625565d4b9f
https://doi.org/10.1109/indicon.2014.7030663
https://doi.org/10.1109/indicon.2014.7030663
Publikováno v:
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
High-end, high-performance computers use high-speed serial interfaces to pass data and control signals between the electronic components in the systems. These interfaces include proprietary interfaces unique to a class of systems and some interfaces,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b156cf27b41e09cd6d7b218522c0091
https://doi.org/10.1109/edaps.2012.6469411
https://doi.org/10.1109/edaps.2012.6469411
Autor:
Greg Edlund, Anil B. Lingambudi
Publikováno v:
2012 Annual IEEE India Conference (INDICON).
The Algorithmic Modeling Interface (AMI) defines a standard syntax for modeling the physical layer of high-speed serial interfaces such as PCI Express (PCIe) and Serial Attach SCSI (SAS). Although it has been gathering momentum since it emerged in 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc52a815225b8e4892df893bcad07c66
https://doi.org/10.1109/indcon.2012.6420767
https://doi.org/10.1109/indcon.2012.6420767