Zobrazeno 1 - 7
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pro vyhledávání: '"Anh Van Nhat Tran"'
Publikováno v:
Journal of The Electrochemical Society. 166:D742-D746
Publikováno v:
Journal of The Surface Finishing Society of Japan. 69:352-355
Publikováno v:
Journal of The Electrochemical Society. 168:052501
A leveller additive, 2-mercapto-5-benzimidazolesulfonic acid (2M5S), is characterized and monitored by cyclic voltammetry stripping (CVS) measurements using a rotating ring disk electrode (RRDE). The ring current gradually decreases with the increase
Publikováno v:
ECS Journal of Solid State Science and Technology. 9:124003
Copper to copper wafer hybrid bonding is the most promising technology for three-dimensional (3D) integration. In the hybrid bonding process, two silicon wafers are aligned and contacted. At room temperature (RT), these aligned copper pads contain ra
Publikováno v:
ECS Meeting Abstracts. :1780-1780
Introduction Cu/SiO2 hybrid bonding is a promising method for 3D stacking of integrated circuits in which the copper bonding of the interconnection pads and direct bonding of the silicon dioxide surface occur simultaneously.1 This bonding technology
Akademický článek
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Publikováno v:
Journal of The Surface Finishing Society of Japan. 68:472-473