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Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
This paper highlights systematic fault isolation approaches to identify back-end of line metal bridging through the combination of techniques such as photon emission, soft defect localization, laser voltage probing as well as combinational logic anal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831e9b93f4dcd2ce1bce55fca10e14a5
https://doi.org/10.1109/ipfa.2017.8060119
https://doi.org/10.1109/ipfa.2017.8060119
