Zobrazeno 1 - 10
of 127
pro vyhledávání: '"Angel Belenguer"'
Publikováno v:
IEEE Access, Vol 12, Pp 61336-61342 (2024)
It is well-known that Empty Substrate Integrated Waveguides allow not only the integration of classic waveguides, such as rectangular waveguides, into a printed circuit board maintaining the quality of traditional waveguide devices, but also keeping
Externí odkaz:
https://doaj.org/article/6922911e731a406b9fe78de7248cc3b7
Autor:
David Herraiz, Hector Esteban, Dario Herraiz, Juan J. De Dios, Marcos D. Fernandez, Angel Belenguer, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 12, Pp 35630-35642 (2024)
High-directivity and low-loss directional couplers based on Empty Substrate Integrated Coaxial Line (ESICL) technology are presented in this article. The proposed coupled line directional couplers are based on the combination of a high-isolation sect
Externí odkaz:
https://doaj.org/article/9a9f2c5425914e8982f40d37c0056fc7
Publikováno v:
IEEE Access, Vol 11, Pp 65599-65607 (2023)
This paper presents a novel dielectricless floating patch antenna structure fed with an empty substrate integrated waveguide (ESIW). The main premise is to eliminate the dielectric from the patch design, which is equivalent to have an air-dielectric
Externí odkaz:
https://doaj.org/article/28fcaca43c5142b7ad7fd72e1afc92e1
Autor:
Darío Herraiz, Angel Belenguer, Marcos Fernandez, Santiago Cogollos, Héctor Esteban, Vicente E. Boria
Publikováno v:
Applied Sciences, Vol 13, Iss 21, p 11698 (2023)
3D printing is one of the most promising manufacturing methods in the most developed technological fields, including microwave hardware fabrication. On the other hand, the well-known manufacturing methods of planar substrate integrated circuits allow
Externí odkaz:
https://doaj.org/article/4a3b65f164ac45b6ade7aa339f17a6e3
Publikováno v:
IEEE Access, Vol 10, Pp 85549-85556 (2022)
The benefits of empty substrate integrated waveguide (ESIW) are already well-known and contrasted in the literature, as well as the benefits of designing filters and other devices according to this technology. Recently, the Folded-ESIW (FESIW) has be
Externí odkaz:
https://doaj.org/article/9e86a61197ac462d875afcc6a39c7ba5
Publikováno v:
IEEE Access, Vol 10, Pp 50418-50426 (2022)
The growing need of space communication systems forces the industry to innovate in order to provide more robust, economical and flexible solutions. The new substrate integrated technologies enable the development of on-board communications devices wi
Externí odkaz:
https://doaj.org/article/be68309361d3472d98ea3b2f64dca573
Autor:
Jose A. Ballesteros, Angel Belenguer, Marcos D. Fernandez, Hector Esteban Gonzalez, Vicente E. Boria
Publikováno v:
IEEE Access, Vol 10, Pp 51412-51418 (2022)
Empty Substrate Integrated Waveguide (ESIW) technology preserves the many advantages of the Substrate Integrated Waveguide (SIW) such as low cost, low profile, and easy integration with Printed Circuit Boards (PCBs). Moreover, it has additional advan
Externí odkaz:
https://doaj.org/article/4a528ee79f144b20b9bae1e8f7fa19d9
Publikováno v:
Applied Sciences, Vol 13, Iss 17, p 9762 (2023)
The advantages of the Substrate-Integrated Waveguide (SIW) in terms of low profile, integration with Printed Circuit Board (PCB) and low cost are maintained by the Empty Substrate-Integrated Waveguide (ESIW). Moreover, as the dielectric fill is avoid
Externí odkaz:
https://doaj.org/article/11e79a3b052643ee9104e2a09724cea2
Publikováno v:
IEEE Access, Vol 9, Pp 76112-76118 (2021)
The benefits of empty substrate integrated waveguide (ESIW) are already well-known and contrasted in the literature. Different variations of transitions are available to maximize the power injection in that structure. Besides, several topological var
Externí odkaz:
https://doaj.org/article/c8245924e1ed4ebd9ab66f8bd276d22c
Publikováno v:
IEEE Access, Vol 9, Pp 165745-165753 (2021)
The Empty Substrate Integrated Waveguides (ESIW) maintain the advantages of the Substrate Integrated waveguide (SIW) (i.e. low-volume, low profile, lightweight, easy manufacturing, and integration in a planar circuit board), and present lower losses
Externí odkaz:
https://doaj.org/article/61f5d372385444ecab9580807e7d7996