Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Ang Ye"'
Autor:
Peng Zhou, Yajun Qi, Chao Yang, Zhiheng Mei, Ang Ye, Kun Liang, Zhijun Ma, Zhengcai Xia, Tianjin Zhang
Publikováno v:
AIP Advances, Vol 6, Iss 12, Pp 125044-125044-9 (2016)
Epitaxial La2/3Sr1/3MnO3 thin films with different crystallographic orientations were fabricated on (001)-, (110)-, and (111)-oriented SrTiO3 substrates by pulsed laser deposition. Out-of-plane magnetic anisotropy was studied with the field angle fix
Externí odkaz:
https://doaj.org/article/881c07e12433499d85ada7b6f37d5efa
Publikováno v:
Journal of Materials Science. 58:2552-2569
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abe77ebb86e7d812b8e02a10fad7d432
https://doi.org/10.1007/s10853-023-08202-2
https://doi.org/10.1007/s10853-023-08202-2
Publikováno v:
Macromolecules. 55:7117-7126
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa5b8de1db02692e95a232d4bb6b5067
https://doi.org/10.1021/acs.macromol.2c00928
https://doi.org/10.1021/acs.macromol.2c00928
Publikováno v:
Saudi Dental Journal, Vol 36, Iss 1, Pp 11-19 (2024)
Purpose: This systematic review is aimed to evaluate in fixed prosthodontics treated teeth, the effect of the BOPT on periodontal health compared to the horizontal preparation technique using a chamfer finishing line or to the baseline. Methods: The
Externí odkaz:
https://doaj.org/article/6ce5edef43a64be49c615b433a25ee63
Publikováno v:
Journal of Applied Sciences. 10:772-776
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff54e75aa0422f14f5ae86ff65681864
https://doi.org/10.3923/jas.2010.772.776
https://doi.org/10.3923/jas.2010.772.776
Autor:
Xiaofei Yang, Chao Yang, Zhijun Ma, Junyu Li, Kun Liang, Zhiheng Mei, Tianjin Zhang, Yajun Qi, Xiangli Liu, Peng Zhou, Ang Ye
Publikováno v:
Applied Physics Express. 10:023201
Pb(Zr0.52Ti0.48)O3/La0.67Sr0.33MnO3 heterostructures grown on 0.7Pb(Mg1/3Nb2/3)O3–0.3PbTiO3 single-crystal substrates with (001), (110), and (111) crystallographic orientations were fabricated. Their structural and ferroelectric properties were stu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2b94ef5badc87f5314bba7b3e365ab3
https://doi.org/10.7567/apex.10.023201
https://doi.org/10.7567/apex.10.023201
Autor:
Ang Ye, Zhijun Ma, Tianjin Zhang, Kun Liang, Peng Zhou, Yajun Qi, Zhengcai Xia, Chao Yang, Zhiheng Mei
Publikováno v:
AIP Advances, Vol 6, Iss 12, Pp 125044-125044-9 (2016)
Epitaxial La2/3Sr1/3MnO3 thin films with different crystallographic orientations were fabricated on (001)-, (110)-, and (111)-oriented SrTiO3 substrates by pulsed laser deposition. Out-of-plane magnetic anisotropy was studied with the field angle fix
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e313582748a48a1fa56a059cc63678e5
https://doaj.org/article/881c07e12433499d85ada7b6f37d5efa
https://doaj.org/article/881c07e12433499d85ada7b6f37d5efa
Publikováno v:
2008 IEEE International Conference on Semiconductor Electronics.
Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07a3d68dfae79103361348514a688d13
https://doi.org/10.1109/smelec.2008.4770385
https://doi.org/10.1109/smelec.2008.4770385
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Various reflow profiles have been applied on different no-clean fluxes amount in removing the oxide layer of high lead solder bump. The wafers exposed to open air induce an oxide layer on the high lead solder bump. This oxide layer eventually creates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::175b570551d92e244c40f3fe57609589
https://doi.org/10.1109/iemt.2008.5507833
https://doi.org/10.1109/iemt.2008.5507833
An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
The role of underfill is expanding from preserving solder joint reliability to also protecting fragile low-k chip dielectric layers in flip chip packaging. The aim of this study is to pre-evaluate or presume the reliability performance of several com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d81e4d72f466cf59bd09c742a666903
https://doi.org/10.1109/iemt.2008.5507780
https://doi.org/10.1109/iemt.2008.5507780