Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ang, Choon Ghee"'
Autor:
Kyaw Ko Lwin, Carolyn Epino Tubillo, Ang Choon Ghee Jim Dimaano, Saravuth Sirinorakul, Daniel Ting Lee Teh, Gu Bin, Nathapong Suthiwongsunthorn
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The increasing demand and requirements for package with smaller footprint, higher dense I/O counts and better performance at lower cost are one of the key challenges faced by semiconductor manufacturing companies. As one of the strategies for sustain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1be9edecdb570bb23fe5617cd1da23ef
https://doi.org/10.1109/eptc.2014.7028389
https://doi.org/10.1109/eptc.2014.7028389
Autor:
Bin, Gu, Dimaano, Jun, Chen, Richen, Bool, Eric, Shi, Seow Fui, Ang, Choon Ghee, Suthiwongsunthorn, Nathapong
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p303-306, 4p
Autor:
Teh, Daniel Ting Lee, Tubillo, Carolyn Epino, Lwin, Kyaw Ko, Bin, Gu, Dimaano, Ang Choon Ghee Jim, Sirinorakul, Saravuth, Suthiwongsunthorn, Nathapong
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p496-502, 7p