Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Andy Hsiao"'
Autor:
Carl H. Naylor, Chelsey Dorow, O'brien Kevin P, Kirby Maxey, Arnab Sen Gupta, Andy Hsiao, Tronic Tristan A, Penumatcha Ashish Verma, Scott B. Clendenning, Gosavi Tanay, Matthew V. Metz, Michael Christenson, Sudarat Lee, Robert L. Bristol, Uygar E. Avci, Alaan Urusa, A. A. Oni, Hui Zhu
Publikováno v:
IEEE Transactions on Electron Devices. 68:6592-6598
2-D-material channels enable ultimate scaling of MOSFET transistors and will help Moore's Law scaling for years. We demonstrate the state of both n- and p-MOSFETs using monolayer transition metal dichalcogenide (TMD) channels of sub-1 nm thickness an
Autor:
Ching-Ping Lin, Yuan-Ting Hsiao, Yu-Jen Andy Hsiao, Shu-Jen Chou, Ai-Ping Chen, Ching-I Kuo, Long-Fang Oliver Chen
Publikováno v:
Mitochondrial DNA. Part B. Resources, Vol 4, Iss 2, Pp 2992-2993 (2019)
The entire chloroplast genome of Aquilaria sinensis (Lour.) Gilg was identified as a circular molecule of 174,885 bp length with a typical tetrad structure, including a pair of inverted repeats (42,103 bp each), a large single copy (87,331 bp) and a
Externí odkaz:
https://doaj.org/article/3b3539111cf54917b1c0a0769ede70dd
Publikováno v:
Journal of Surface Mount Technology. 33:7-13
Conformal coating is commonly used for harsh environment to protect electronics from moisture and chemical contaminants. But the stresses imparted by the conformal coating can cause degradation to the package thermal cycle performance. Full coverage
Publikováno v:
Journal of Surface Mount Technology. 33:22-27
Various external load conditions affecting components on electronic devices and modules are constant factors, which need to be considered for the component long-term reliability. Recently, to enhance the high stress component thermo-mechanical cyclin
Publikováno v:
Journal of Electronic Materials. 50:699-709
The effects of different via pad configurations on solder joint reliability during thermal cycling have been investigated. Implementation of the via-in-pad plated over (VIPPO) design configuration induced additional loading conditions for each ball g
Publikováno v:
Mobile Technologies for Delivering Healthcare in Remote, Rural or Developing Regions ISBN: 9781839530470
UN sustainable development goal (SDG) regards universal health coverage as integral to achieving SDG 3 'good health and well-being' and ending poverty and reducing inequalities. Yet, in responding this global challenge, UN also reports, 'the world is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fe3f9efd53df4e301ee6cacec56393e
https://doi.org/10.1049/pbhe024e_ch1
https://doi.org/10.1049/pbhe024e_ch1
Publikováno v:
Science, Technology and Innovation Studies ISBN: 9783030583002
Since the industrial revolution, the global industrial economy continues to expand rapidly. The automotive industry enabled people to live outside of cities and commute in. The aerospace industry has linked not only states but entire countries. Henry
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9c77178d64f1848d1b587bfdc27076a
https://doi.org/10.1007/978-3-030-58301-9_2
https://doi.org/10.1007/978-3-030-58301-9_2
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Large body-size and heterogeneously integrated packages have become essential for high-performance computing applications. As an example, designs such as silicon interposer-based 2.5D packages have enabled the integration of high-performance silicon
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The impact of uneven strain distribution induced by mixed via in pad plated over (VIPPO) configuration in thick printed circuit boards is investigated. To identify the tension and compression strain during thermal cycling, BGA components with 0.5mm p