Zobrazeno 1 - 10
of 47
pro vyhledávání: '"Andy Heinig"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2171-2182
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::706472929f28194f79f0bedc95a96bfa
https://doi.org/10.1109/tcpmt.2021.3117118
https://doi.org/10.1109/tcpmt.2021.3117118
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f35432c5aef7d4f5b9935df37ee5631d
https://doi.org/10.1109/eptc56328.2022.10013138
https://doi.org/10.1109/eptc56328.2022.10013138
Autor:
Robert Trieb, Andy Heinig
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c0a703ba7883b8295bd91dfe398066b
https://doi.org/10.1109/ectc51906.2022.00051
https://doi.org/10.1109/ectc51906.2022.00051
Autor:
Andy Heinig, Fabian Hopsch
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ef5df874fbb8f487eec562389081752
https://doi.org/10.1109/eptc53413.2021.9663885
https://doi.org/10.1109/eptc53413.2021.9663885
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02efdb0aa4e3ae885ddc22323dd654f0
https://doi.org/10.1109/eptc53413.2021.9663983
https://doi.org/10.1109/eptc53413.2021.9663983
Autor:
André Lange, Fabio A. Velarde Gonzalez, Kay-Uwe Giering, Anastasios Vervantidis, Lukas Hahne, Andy Heinig, Roland Jancke
Publikováno v:
Microelectronics Reliability. 137:114775
The importance of integrated circuit (IC) reliability has been growing to benefit from the potentials of advanced semiconductor technologies in long-living applications, such as automotive electronics. Today, prototypes and products are tested for th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3cbe5d60c1a05548c87f719d0a730aef
https://doi.org/10.1016/j.microrel.2022.114775
https://doi.org/10.1016/j.microrel.2022.114775
Publikováno v:
Handbook of 3D Integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::890d90f4f889070e560531e2e26c3f6d
https://doi.org/10.1002/9783527697052.ch4
https://doi.org/10.1002/9783527697052.ch4
Publikováno v:
ICECS
Communication between dies in a multi-chip system requires low power consumption. Silicon area consumed by drivers should also be minimized. Traditionally, drivers for multichip communication are designed for maximum channel loss estimated in a given
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::779b88f34c3c6883d6e7e5e213c653e4
https://doi.org/10.1109/icecs49266.2020.9294796
https://doi.org/10.1109/icecs49266.2020.9294796
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
Advanced packages are necessary to cope with the requirements of 5G and radar technologies with 60 GHz and beyond. For proper RF design with rising package technology requirements demands for usage of predefined structures with predefined layout elem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48ad9715bc61c8ff13fff749d3dc08a3
https://doi.org/10.23919/iwlpc52010.2020.9375897
https://doi.org/10.23919/iwlpc52010.2020.9375897
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Multi-chip communication interfaces on an interposer or a package substrate must consume minimum routing area while consuming low power in the transceiver blocks. This paper presents an algorithm to design this channel in view of energy and area metr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3079089c195a7394c6ff63af195a3d2a
https://doi.org/10.1109/epeps48591.2020.9231389
https://doi.org/10.1109/epeps48591.2020.9231389