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pro vyhledávání: '"Andy Burnett"'
Publikováno v:
Journal of Clinical and Translational Science, Vol 8 (2024)
Abstract Introduction: Despite the central importance of cross-disciplinary collaboration in the Clinical and Translational Science Award (CTSA) network and the implementation of various programs designed to enhance collaboration, rigorous evidence
Externí odkaz:
https://doaj.org/article/c3fde108fa934051a950f6922273c6a5
Publikováno v:
International Symposium for Testing and Failure Analysis.
Accurate root cause determination of integrated circuit devices necessitates the preservation of evidence during failure analysis. Identifying the cause of systemic defects requires capturing physical evidence provided by very few customer returns. E
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Galvanic corrosion generally occurred on Al/Cu bond pads post wafer saw resulted in pitting but no pitting was observed at wafer incoming. There is significant interest in the corrosion behavior of Cu-containing Al alloy, such as PL455, which remain