Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Andrzej Moscicki"'
Autor:
Mateusz Kanus, Damian Nowak, Andrzej Moscicki, Jan Felba, Przemyslaw Matkowski, Krzvsztof Stojek
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Research aim was to develop thermal analysis method of thermal joints made by sintered silver nanoparticles in real structures. Each layer in sandwich-like structures in typical microelectronics structures introduces thermal resistance of layer and s
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
the development of heat transfer efficiency measurement method through thermal joints made by low temperature and low pressure silver sintering is presented. The research included using reflection of infrared radiation, designing new sample geometry
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The materials and technology parameters impact on mechanical properties for non-metalized silver-based joints made by low-temperature and low-pressure sintered Si surface with using silver nanoparticles is presented. The research approach based on su
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
The mechanical strength of non-metalized silicon joints made with low-temperature and low-pressure silver nanoparticles sintering was discussed. Material composition, as far as sintering process parameters impact on mechanical strength was presented
Autor:
Andrzej Moscicki, Tomasz Falat, Jan Felba, W. Macherzyński, Przemyslaw Matkowski, Krzysztof Stojek
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the
Publikováno v:
Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales.
This study investigates the effect of silver paste composition on reliability of sintered silver interconnections. The interconnections are formed between SMD 1206 chip jumpers and electroless nickel immersion gold (ENIG) coating of FR4 printed circu
Autor:
Jan Felba, Andrzej Moscicki, Krzysztof Stojek, Tomasz Falat, Przemyslaw Matkowski, Bartosz Platek
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE).
The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are current
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Nowadays a passive cooling based on efficient reliable thermal interfaces begins to play a dominant role in modern consumer electronics. The devices become smaller, thinner and more powerful while semiconductors become the source of higher flux heat
Autor:
Andrzej Moscicki, Tomasz Falat, Przemyslaw Matkowski, Krzysztof Stojek, Bartosz Platek, Jan Felba
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
One of the largest problems connected with actual electronic and microelectronics systems is removing of heat generated by them, particularly through the power elements. The most so far widespread technical solutions in the range of high thermally co