Zobrazeno 1 - 10
of 181
pro vyhledávání: '"Andrzej Dziedzic"'
Autor:
Adriana Barylyak, Joanna Kisała, Przemysław Fornal, Yaroslav Bobitski, Andrzej Dziedzic, Małgorzata Kus-Liśkiewicz
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-8 (2024)
Abstract Orthodontic adhesive doped with sulfur-modified TiO2 promotes antibacterial effect. The objective of the study was to characterize the physical, mechanical and antibacterial properties of the orthodontic bracket adhesive, doped with modified
Externí odkaz:
https://doaj.org/article/42af5d90008846c5a435c9a7829df577
Autor:
Andrzej Dziedzic, Szymon Wójcik, Mirosław Gierczak, Slavko Bernik, Nana Brguljan, Kathrin Reinhardt, Stefan Körner
Publikováno v:
Sensors, Vol 24, Iss 5, p 1646 (2024)
This paper presents an innovative approach to the integration of thermoelectric microgenerators (μTEGs) based on thick-film thermopiles of planar constantan–silver (CuNi-Ag) and calcium cobaltite oxide–silver (Ca3Co4O9-Ag) thick-film thermopiles
Externí odkaz:
https://doaj.org/article/e13467284be848a895680b5fb069a637
Autor:
Bartosz Skóra, Urszula Krajewska, Anna Nowak, Andrzej Dziedzic, Adriana Barylyak, Małgorzata Kus-Liśkiewicz
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-13 (2021)
Abstract Drug-resistance of bacteria is an ongoing problem in hospital treatment. The main mechanism of bacterial virulency in human infections is based on their adhesion ability and biofilm formation. Many approaches have been invented to overcome t
Externí odkaz:
https://doaj.org/article/b77eb6939a15475ba4c1468ff3a240c0
Publikováno v:
Journal of Engineering, Vol 2022 (2022)
This paper presents a new methodology for simulation of production processes in order to determine device parametric yield. The elaborated methodology is focused on capturing stochastic relations between every parameter of the subsequent processes th
Externí odkaz:
https://doaj.org/article/caaebf7f20cf49b6a528d0e5f8308b72
Autor:
Imen Ben Tahar, Patrick Fickers, Andrzej Dziedzic, Dariusz Płoch, Bartosz Skóra, Małgorzata Kus-Liśkiewicz
Publikováno v:
Microbial Cell Factories, Vol 18, Iss 1, Pp 1-11 (2019)
Abstract Background Synthesis of nanoparticles (NPs) and their incorporation in materials are amongst the most studied topics in chemistry, physics and material science. Gold NPs have applications in medicine due to their antibacterial and anticancer
Externí odkaz:
https://doaj.org/article/ecb471216e884b78bff79249680d5ca7
Publikováno v:
Energies, Vol 15, Iss 3, p 1014 (2022)
The purpose of this paper is to analyze the magnetic field distribution over a disc with magnets. This disk is part of an electromagnetic microgenerator that allows the generation of electricity as a result of changes in the magnetic field. The other
Externí odkaz:
https://doaj.org/article/fe8d405dfbe94fd091b45ab6ce9e52a8
Publikováno v:
Micromachines, Vol 10, Iss 9, p 556 (2019)
This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two
Externí odkaz:
https://doaj.org/article/2a5014dc1f084f2eaaaf2a857cd2ce71
Publikováno v:
Dalton Transactions. 52:2580-2591
Different types of ferrite core–shell structures, namely CoFe2O4@CoFe2O4, CoFe2O4@Fe3O4, CoFe2O4@MnFe2O4, and CoFe2O4@MnFe2O4@ZnFe2O4, were prepared by the seed-mediated approach.
Autor:
Wojciech Stęplewski, Andrzej Rybak, Andrzej Dziedzic, Marcin Bialas, Mariusz Wojcik, Dariusz Ostaszewski, Edward Ramotowski, Kamil Janeczek, Aneta Chołaj, Marek Kościelski, Anna Sitek, Dorota Liszewska
Publikováno v:
Journal of Electronic Materials.
Autor:
Wojciech Stęplewski, Andrzej Rybak, Andrzej Dziedzic, Marcin Bialas, Mariusz Wojcik, Dariusz Ostaszewski, Edward Ramotowski, Kamil Janeczek, Aneta Chołaj, Marek Kościelski, Anna Sitek, Dorota Liszewska
Publikováno v:
Journal of Electronic Materials.
The technique of embedding components inside printed circuit boards (PCBs) is described, using different filling masses. To investigate the possibility of placing the components inside the printed circuit board, a residual circuit breaker with an ove