Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Andrew N. Smith"'
Publikováno v:
IEEE Transactions on Industrial Electronics. 70:11299-11309
Autor:
Myriam Brouard, Katja H. Brunk, Mario Campana, Marlon Dalmoro, Marcia Christina Ferreira, Bernardo Figueiredo, Daiane Scaraboto, Olivier Sibai, Andrew N. Smith, Meriam Belkhir
Publikováno v:
Journal of Public Policy & Marketing. 42:56-73
Ethnoracial minorities are often racialized and consequently excluded from various consumption contexts. Racialized market actors strive to overcome exclusion and gain participation in markets; however, these efforts are often insufficient because th
Publikováno v:
Journal of the Academy of Marketing Science. 51:198-221
Publikováno v:
Journal of Business Research. 134:143-155
The sports industry has eagerly embraced digital technologies that have the potential to create and nurture compelling fan experiences. In this study, we investigate how and why complementary digital experiences (CDXs)—touchpoints in the customer j
Publikováno v:
Journal of Marketing Education. 43:354-370
Student engagement is regarded as a critical educational outcome. However, it has proven to be elusive to educators within technical domains, such as marketing research and analytics, which has inspired the exploration of experiential course design e
Publikováno v:
Journal of Business Research. 122:145-158
The relationship between trust and outcome-related responses to electronic word-of-mouth (eWOM) is well-established in research. However, researchers’ consideration and measurement of trust are rooted in, and limited by, the field’s origins in st
Autor:
Joachim Scholz, Andrew N. Smith
Publikováno v:
Journal of Marketing Management. 35:1100-1134
Leading research on social media firestorms typically advises managers to quickly quell the backlash by appeasing brand critics. Drawing on crisis communications and branding research, we offer a r...
Publikováno v:
International Journal of Heat and Mass Transfer. 130:874-881
Interfaces play a critical role in heat dissipation for electronics packaging applications, thermoelectric energy conversion, data center cooling and renewable energy systems architectures. They are particularly influential as device length scales ar
Autor:
Adam A. Wilson, Andrew N. Smith, Ibrahim Karaman, Raymundo Arroyave, Alaa Elwany, K. Can Atli, Asher C. Leff, Darin J. Sharar
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This study reports the use of Additively Manufactured nitinol as a high-performance metallic solid-solid phase change material. Compared to standard phase change materials, which offer point solutions, it’s shown here that latent heat, thermal cond
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal resistance arises at the interface of two different materials. However, developers of sensors, electronics, and power conversion devices often ignore this effect. The additional thermal resistance imposed due to interface can enhance sensitiv