Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Andrew Kummel"'
Publikováno v:
IEEE Journal of Microwaves, Vol 4, Iss 1, Pp 147-157 (2024)
Compact millimeter-wave arrays demand novel packaging solutions that feature low-cost dielectric materials with significant thermal conductivity ($\sim$100 W/m ⋅ K). To characterize the permittivity and loss tangent of the dielectric materials abov
Externí odkaz:
https://doaj.org/article/8412c12141dd481cbb71827511949c72
Publikováno v:
APL Materials, Vol 6, Iss 6, Pp 066104-066104-9 (2018)
Various methods to passivate the sulfur vacancy in 2D MoS2 are modeled using density functional theory (DFT) to understand the passivation mechanism at an atomic scale. First, the organic super acid, bis(trifluoromethane)sulfonimide (TFSI) is a stron
Externí odkaz:
https://doaj.org/article/139a60aa96d24fceb53deb1615e04070
Publikováno v:
Cancer Research. 83:P3-07
Adenoviral vectors have been used extensively for gene therapy. However, efficient infection of cells requires expression of the coxsackie-adenoviral receptor (CAR). Many tumor cells lack adequate expression of CAR and, hence, are not good targets fo
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Kisung Chae, Sarah F. Lombardo, Nujhat Tasneem, Mengkun Tian, Harish Kumarasubramanian, Jae Hur, Winston Chern, Shimeng Yu, Claudia Richter, Patrick D. Lomenzo, Michael Hoffmann, Uwe Schroeder, Dina Triyoso, Steven Consiglio, Kanda Tapily, Robert Clark, Gert Leusink, Nazanin Bassiri-Gharb, Prab Bandaru, Jayakanth Ravichandran, Andrew Kummel, Kyeongjae Cho, Josh Kacher, Asif Islam Khan
Publikováno v:
ACS Applied Materials & Interfaces. 14:36771-36780
Autor:
Qing Lin, Gregory Pitner, Carlo Gilardi, Sheng-Kai Su, Zichen Zhang, Edward Chen, Prabhakar Bandaru, Andrew Kummel, Han Wang, Matthias Passlack, Subhasish Mitra, H.-S. Philip Wong
Publikováno v:
IEEE Electron Device Letters. 43:490-493
Autor:
Sou-Chi Chang, Kisung Chae, Mihaela I. Popovici, Chia-Ching Lin, Saima Siddiqui, I-Cheng Tung, Jasper Bizindavyi, Bernal Granados Alpizar, Nazila Haratipour, Matthew Metz, Jack Kavalieros, Gouri S. Kar, Andrew Kummel, Kyeongjae Cho, Uygar E. Avci
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Autor:
Huang, James, Cho, Yunil, Wang, Victor, Zhang, Zichen, Mu, Jing, Yadav, Ajay, Wong, Keith, Nemani, Srinivas, Yieh, Ellie, Andrew, Kummel
Publikováno v:
ACS Applied Materials & Interfaces; 5/31/2023, Vol. 15 Issue 21, p26128-26137, 10p
Autor:
Michael Breeden, Victor Wang, Ravindra Kanjolia, Mansour Moinpour, Jacob Woodruff, Harsono Simka, Andrew Kummel
Publikováno v:
2022 IEEE International Interconnect Technology Conference (IITC).
Autor:
Evgueni, Chagarov, Kasra, Sardashti, Tobin, Kaufman-Osborn, Shailesh, Madisetti, Serge, Oktyabrsky, Bhagawan, Sahu, Andrew, Kummel
Publikováno v:
ACS applied materialsinterfaces. 7(47)
Density-functional theory molecular dynamics simulations were employed to investigate direct interfaces between a-Al2O3 and Si0.50Ge0.50 with Si- and Ge-terminations. The simulated stacks revealed mixed interfacial bonding. While Si-O and Ge-O bonds