Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Andrew Galpin"'
Publikováno v:
ECS Transactions. 41:27-32
This paper focuses on the challenges and new developments in chemical mechanical planarization (CMP) pad conditioner technology for the next-generation applications, with a special emphasis on the comparative performance characterization of pad condi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d7658af371d99fee2121641e775c9af
https://doi.org/10.1149/1.3699375
https://doi.org/10.1149/1.3699375
Autor:
Rakesh K. Singh, Raghava Kakireddy, Karim Bennedine, Andrew Galpin, Xiaomin Wei, Alain Chabourel, Ara Philipossian, Christopher Wargo, Claude Reversat, Joseph E. Smith
Publikováno v:
MRS Proceedings. 1249
The focus of this work is wafer retaining rings and their impact on chemical mechanical planarization (CMP) process stability, yield, and overall cost of ownership (CoO). The study looks at various CMP retaining ring materials and processing methods.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaa1a7d61ecab64d8f8543d1d3f076fd
https://doi.org/10.1557/proc-1249-e02-01
https://doi.org/10.1557/proc-1249-e02-01
Publikováno v:
ECS Meeting Abstracts. :2318-2318
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5869b82662335249da641921f7a51a9
https://doi.org/10.1149/ma2011-02/37/2318
https://doi.org/10.1149/ma2011-02/37/2318