Zobrazeno 1 - 10
of 206
pro vyhledávání: '"Andrew A O Tay"'
Publikováno v:
Micromachines, Vol 14, Iss 10, p 1953 (2023)
The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of nanometers to sub-microns in the IC back end of the line stack, which put stringent demands on the r
Externí odkaz:
https://doaj.org/article/aec6f7295ed64fff9d58814899309278
Publikováno v:
Sustainable Environment Research, Vol 29, Iss 1, Pp 1-10 (2019)
Abstract The paper describes the implementation of a photo-voltaic thermal (PVT) system for a student hostel located in Singapore to cater for hot water requirements of the hostel and a part of electricity requirement. Real-time data monitoring was c
Externí odkaz:
https://doaj.org/article/ec7865bd4d6341258aa4fce950023ba5
Publikováno v:
AIP Advances, Vol 7, Iss 9, Pp 095320-095320-10 (2017)
Three-dimensional (3D) integration technology using Cu interconnections has emerged as a promising solution to improve the performance of silicon microelectronic devices. However, Cu diffuses into SiO2 and requires a barrier layer such as Ta to ensur
Externí odkaz:
https://doaj.org/article/7fa8dd3f0c064032a7a66896711b2aed
Autor:
S. Anbazhagan, Gregoria Illya, Andrew A. O. Tay, W.J.R. Song, Sasi Kumar Tippabhotla, Arief Suriadi Budiman, Rahul Sahay
Publikováno v:
Solar Energy. 220:462-472
Cracks in brittle silicon solar cells (wafers) are a major concern in the solar photovoltaics (PV) industry. Because of the slicing of the wafers from large ingots and further stressing during subsequent operations such as soldering and laser cutting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fae177f5fffb5bd7c36ecf3475be938
https://doi.org/10.1016/j.solener.2021.03.021
https://doi.org/10.1016/j.solener.2021.03.021
Publikováno v:
Journal of Electronic Packaging. 143
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f60d3a3db7ea9e8fe7c5f8acf27a2b8b
https://doi.org/10.1115/1.4052174
https://doi.org/10.1115/1.4052174
Autor:
Andrew A. O. Tay, Nobumichi Tamura, Camelia V. Stan, W.J.R. Song, Sasi Kumar Tippabhotla, Arief Suriadi Budiman, Anbalagan Subramani
Publikováno v:
MRS Advances. 4:2319-2335
Fracture of crystalline silicon (c-Si) solar cells in photovoltaic modules is a big concern to the photovoltaics (PV) industry. Cell cracks cause performance degradation and warranty issues to the manufacturers. The roots of cell fractures lie in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f66907b3361476b4d6935bc51bdf28fa
https://doi.org/10.1557/adv.2019.337
https://doi.org/10.1557/adv.2019.337
Autor:
Muhannad S. Bakir, Suresh K. Sitaraman, Avram Bar-Cohen, Jeffrey C. Suhling, Andrew A. O. Tay
Publikováno v:
Encyclopedia of Packaging Materials, Processes, and Mechanics. :i-xii
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39afe2e72d9b5a41d1d79b5f002cc511
https://doi.org/10.1142/9789811209673_fmatter
https://doi.org/10.1142/9789811209673_fmatter
Publikováno v:
Solar Energy. 182:134-147
The fracture of the silicon cells and associated performance degradation is a major hindrance to the long-term viability of solar photovoltaics as a main-stream power source. The stress induced in the cells during the photovoltaic module integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::040182b9d01fdd2d1eee1b97a29bc912
https://doi.org/10.1016/j.solener.2019.02.028
https://doi.org/10.1016/j.solener.2019.02.028
Publikováno v:
Solar Energy Materials and Solar Cells. 187:241-248
Fracture in silicon crystalline solar cells has been a long-standing challenge encountered in the photovoltaic (PV) industry. This occurs as result of stresses developing in the cells due to thermo-mechanical stresses that arise when there is a misma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::644681317bc743f44377c2139dc5ddaf
https://doi.org/10.1016/j.solmat.2018.07.026
https://doi.org/10.1016/j.solmat.2018.07.026
High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric
Autor:
Zhuo Chen, Lei Shi, Junhui Li, Ganglong Li, Andrew A. O. Tay, Liancheng Wang, Guang Zheng, Zijun Ding, Wenhui Zhu
Publikováno v:
Journal of Materials Science. 54:2379-2391
Development of low-k materials is critical for further improving the performance of integrated circuits. In this work, a novel type of fluorine-doped ultra-low-k porous SiCOH films has been produced. The chemical composition and bond configurations o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::995373e8df661039c35c635440b69de5
https://doi.org/10.1007/s10853-018-3013-x
https://doi.org/10.1007/s10853-018-3013-x