Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Andreas Stich"'
Publikováno v:
Microelectronic Engineering. 83:2386-2390
Electrical measurements demonstrate that some metastable defects are present inside airgap interconnect structures realized with the close-off approach. Leakage and capacitance strongly depend on sweep conditions and temperature, which suggests the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::794db4e26490f988c4210661c07afca6
https://doi.org/10.1016/j.mee.2006.10.042
https://doi.org/10.1016/j.mee.2006.10.042
Publikováno v:
Microelectronic Engineering. 82:362-367
Air gaps offer an interesting alternative to low-k or ultra-low-k materials in order to reduce the line-to-line capacitance in a metallization system. A possible approach for air gap fabrication is based upon selective ozone/TEOS deposition. Feasibil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc451c6f884d7c1050c80f64bf284c4f
https://doi.org/10.1016/j.mee.2005.07.017
https://doi.org/10.1016/j.mee.2005.07.017
Autor:
Andreas Stich
Publikováno v:
Urban Studies. 36:1649-1660
This paper investigates the effect of city size on income inequality in Germany after reunification. Using the Gini index, income inequality is computed. No correlation between income inequality and city size can be found, but dividing Germany in Eas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5250fd376447945ee3e79fff5ad0bef9
https://doi.org/10.1080/0042098992755
https://doi.org/10.1080/0042098992755
Autor:
M. Traving, M. Engelhardt, Günther Schindler, Werner Pamler, Zvonimir Gabric, Andreas Stich, W. Honlein
Publikováno v:
AIP Conference Proceedings.
Copper‐based nano interconnects featuring CDs well beyond today’s chip generations and air gap structures were fabricated and subjected to electrical characterization and tests to get already today insight on functionality and reliability aspects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b4e53533eb32fa61900efd51d13761c
https://doi.org/10.1063/1.2173526
https://doi.org/10.1063/1.2173526
Publikováno v:
2006 International Interconnect Technology Conference.
The electrical properties of copper metal lines within an air gap scheme were measured and compared to structures without air gaps. Two metal layers with air gap structures using a close-off processing scheme with selective ozone TEOS deposition were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58e9d765977a9e41dafc329a1ee40917
https://doi.org/10.1109/iitc.2006.1648668
https://doi.org/10.1109/iitc.2006.1648668
Autor:
F. Gaillard, J. Torres, G. Imbert, V. Girault, Lucile Arnaud, Roel Daamen, Vincent Jousseaume, Zvonimir Gabric, Gérard Passemard, Romano Hoofman, L.G. Gosset, J. Mitard, Vincent Arnal, M. Assous, C. Guedj, Werner Pamler, Andreas Stich, A. Toffoli, Laurent Favennec, D. Bouchu
Publikováno v:
2006 International Interconnect Technology Conference.
The spectral photoresponse of advanced interconnects is potentially interesting for the precise characterization of advanced interconnects, using standard comb test structures under illumination. This electro-optical method provides detailed informat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1068b959c2552005d7e2608d88bcf620
https://doi.org/10.1109/iitc.2006.1648695
https://doi.org/10.1109/iitc.2006.1648695
Autor:
Friedrich Schmid, Andreas Stich
Publikováno v:
Mathematische Methoden der Wirtschaftswissenschaften ISBN: 9783662124345
This paper revisits finite normal mixtures as models for the distribution of daily stock returns. Estimates for parameters of finite mixtures can easily be derived from the well known EM-algorithm which turns out to be numerically stable for the type
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c10ae5d016a01028904b89871516e516
https://doi.org/10.1007/978-3-662-12433-8_25
https://doi.org/10.1007/978-3-662-12433-8_25
Publikováno v:
SID Symposium Digest of Technical Papers. 35:1222
In this paper, we will introduce a novel MultiLED package that is ideal for application as a light source in LCD backlighting systems. We will discuss its optical, thermal and electrical performance in a prototype for a 17″ LCD monitor and demonstr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a928bfc564a7dc797441dd0576e7c9f
https://doi.org/10.1889/1.1821338
https://doi.org/10.1889/1.1821338