Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Andreas Stegmaier"'
Autor:
Andreas Stegmaier, Ole Hölck, Marius van Dijk, Hans Walter, Olaf Wittler, Martin Schneider-Ramelow
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Marius van Dijk, Saskia Huber, Andreas Stegmaier, Hans Walter, Olaf Wittler, Martin Schneider-Ramelow
Publikováno v:
Microelectronics Reliability. 135:114585
Controlling warpage effects in fan-outwafer-level packaging (FO-WLP) is of key importance for realizing reliable and cost-efficient system in packages (SiPs). However, warpage effects can occur during the manufacturing process, caused by a combinatio
Autor:
Martin Schneider-Ramelow, Hans Walter, Andreas Stegmaier, Saskia Huber, Olaf Wittler, Marius van Dijk
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Controlling warpage effects in fan-out wafer level packaging (FO-WLP) is of key importance for realizing reliable and cost-efficient system in packages (SiPs). During the manufacturing process however, warpage effects occur caused by a combination of
Autor:
Johannes Jaeschke, Martin Schneider-Ramelow, Marius van Dijk, Olaf Wittler, Andreas Stegmaier
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Warpage issues during the processing of System in Packages (SiPs), by means of Fan-Out Wafer Level Packaging (FO-WLP), is still a challenging task. The differences in thermal expansion coefficients of the dissimilar materials, as well as the cure-shr
Autor:
Werner Dreher, Michael Haase, Michael Fischer, Jürgen Scherle, Andreas Stegmaier, Roland Mayer-Föll, Günter Barnikel, Thomas Riedel
Publikováno v:
WASSERWIRTSCHAFT. 95:20-24