Zobrazeno 1 - 1
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pro vyhledávání: '"Andreas Pinkernelle"'
Autor:
Benjamin März, Michael Rother, Tina Li, Kan Lee, Hans-Juergen Funke, Robert Klengel, Mandy Ullrich, Mark Luke Farrugia, Karina Leung, Tim Boettcher, Martin Li, Orla O'Halloran, Andreas Pinkernelle, Matthias Petzold, Michael Kaiser, Stefan Liedtke, Marc Bollmann, Daniel Gruber
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
A detailed description of the Cu-Al wire bond interface is presented, which can possibly explain the often observed corrosion failures in humidity reliability tests. Using micro-structural analysis techniques, it is shown that the unstressed interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1e10ff42133020288220649e990d270
https://doi.org/10.1109/eptc.2010.5702706
https://doi.org/10.1109/eptc.2010.5702706
