Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Andreas Munding"'
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
System integration for LED lighting is facing the challenge of providing many additional smart functions in one housing of small form factor. A possible way to integrate more functionality into smaller volume is a system in package (SiP) approach whi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1dc3d3a5c9d0d13275e068cadc67ccd
https://doi.org/10.1109/estc.2018.8546347
https://doi.org/10.1109/estc.2018.8546347
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
We investigate the reliability of a system-in-package (SiP) technology, which uses laminate chip embedding based on a copper leadframe. For this SiP technology, we apply different Si-based transistor technologies. We test the reliability of three typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a1025a61d475a533c7e9d68dd63e1d18
https://doi.org/10.1109/estc.2018.8546426
https://doi.org/10.1109/estc.2018.8546426
Autor:
Ulrich Ramacher, A. Kaiser, H. Hübner, A. Heittmann, Erhard Kohn, Andreas Munding, Hans-Jörg Pfleiderer, M. Bschorr, P. Benkart
Publikováno v:
Advances in Radio Science, Vol 4, Pp 225-229 (2006)
This work presents a system to increase the yield of a novel 3-D chip integration technology. A built-in self-test and a routing system have been developed to identify and avoid faults on vertical connections between different stacked chips. The 3-D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::da9d3002d676f62d6094a96cb3f557a9
https://www.adv-radio-sci.net/4/225/2006/
https://www.adv-radio-sci.net/4/225/2006/
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Laminate chip embedding tailored to very thin dies is an attractive package technology for the integration of logic and power dies. In this paper we report on a new leadframe based laminate chip embedding technology. Best benefit from this technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e16d249d45f8e823539f76f403610ccc
https://doi.org/10.1109/ectc.2017.261
https://doi.org/10.1109/ectc.2017.261
Publikováno v:
ATZelektronik. 6:54-59
Die Leistungselektronik-Komponenten in heutigen Hybridfahrzeugen sind an unterschiedlichen Orten im Fahrzeug untergebracht - bisher noch jenseits eines rauen und heissen "Umfelds". Um eine integrierte, getriebenahe Loesung zu entwickeln, haben ZF und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fdfdb3295c819655ff4c138ce2d966f
https://doi.org/10.1365/s35658-011-0048-z
https://doi.org/10.1365/s35658-011-0048-z
Publikováno v:
ATZelektronik worldwide. 6:36-39
places in the vehicle – till now far away from harsh and hot surroundings. In order to develop an integrated solution near the transmission, ZF and BMW launched the research project “Electric components for active power transmissions” (EfA). On
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fc763e278312deb442c99346ec1bc3e
https://doi.org/10.1365/s38314-011-0030-9
https://doi.org/10.1365/s38314-011-0030-9
Autor:
Andreas Munding, Erhard Kohn, Ulrich Ramacher, H. Huebner, P. Benkart, A. Kaiser, A. Heittmann
Publikováno v:
Sensors and Actuators A: Physical. 139:350-355
A solution for the wiring problem in highly complex and embedded systems is the technology of three-dimensional integration. This approach allows a high interconnect density between two or more chips with very short signal or power lines. With the ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1bb4092953b1aa6fba541713138f78e
https://doi.org/10.1016/j.sna.2007.04.032
https://doi.org/10.1016/j.sna.2007.04.032
Autor:
H. Huebner, D. Kueck, Andreas Munding, Rolf Sauer, G.M. Prinz, E. Kohn, P. Benkart, A. Heittmann, A. Kaiser
Publikováno v:
Diamond and Related Materials. 15:1967-1971
In this investigation we present a novel technology for three-dimensional integration of diamond sensors and actuators. Based on a previously developed technology for the integration of a 3-D CMOS camera stack, in this attempt nano-crystalline diamon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a7d3244bdd71be03661bc4cb84fede0
https://doi.org/10.1016/j.diamond.2006.07.012
https://doi.org/10.1016/j.diamond.2006.07.012
Publikováno v:
Diamond and Related Materials. 15:773-776
In this work we present a bi-stable diamond micro-bridge with a centre operating contact, which can be used in various fields of application. The actuator is based on the thermal bi-metal actuation principle, switching a double anchored cantilever be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ab961db1d3fd699d6f39c5097581409
https://doi.org/10.1016/j.diamond.2005.11.054
https://doi.org/10.1016/j.diamond.2005.11.054
Autor:
M. Bschorr, Ulrich Ramacher, P. Benkart, Erhard Kohn, H. Huebner, Andreas Munding, H.-J. Pfleiderer, A. Kaiser, A. Heittmann
Publikováno v:
IEEE Design and Test of Computers. 22:512-518
The current technology in micro-and nano-electronics is insufficient to meet future demands for several applications. Most state-of-the-art solutions rely on so-called embedded technologies, which are both expensive and complex. One solution to the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e00a08998944a298005d29ca9c594c4
https://doi.org/10.1109/mdt.2005.125
https://doi.org/10.1109/mdt.2005.125