Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Andreas Middendorf"'
Autor:
Klaus Dieter Lang, Andreas Middendorf
Publikováno v:
International Symposium on Microelectronics. 2014:000361-000366
Investigations regarding the failure behavior of heavy wire bonds show a significant decrease of cycles in strength with increasing wire diameter. The article explains the reasons theoretically. Based on the theory, possibilities to increase reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86486346a56bc531f6a88083443293fe
https://doi.org/10.4071/isom-tp64
https://doi.org/10.4071/isom-tp64
Autor:
Holger Voelkel, Robert Vodiunig, Ingo Birner, Andreas Middendorf, Abdalla Youssef, Hans Christian Walter, Klaus-Dieter Lang, Jean Thierauf
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Interconnect technologies play a vital role to provide the necessary electrical, mechanical and thermal interconnections in electronic assemblies. They are considered as one of the most critical factors governing the lifetime and reliability of the w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87ba2c895613b70921d7efd0d06f02f9
https://doi.org/10.1109/eptc.2016.7861552
https://doi.org/10.1109/eptc.2016.7861552
Autor:
Klaus-Dieter Lang, Robert Vodiunig, Ingo Birner, Holger Voelkel, Jean Thierauf, Abdalla Youssef, Andreas Middendorf
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Electronic control units (ECUs) in automotive industry are exposed to extreme harsh electrical and physical working conditions. Moreover, due to the continuous innovation in automotive industry, complexity and miniaturization of these systems are inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd72d225298c3b276300053fe1cbbdc9
https://doi.org/10.1109/eurosime.2016.7463312
https://doi.org/10.1109/eurosime.2016.7463312
Publikováno v:
Zeitschrift für wirtschaftlichen Fabrikbetrieb. 103:544-548
Kurzfassung Zuverlässigkeit ist für moderne technische Produkte eine Grundvoraussetzung für den wirtschaftlichen Erfolg. Bedingt durch die hohe Komplexität der zumeist mechatronischen Systeme und die vielfältigen Abhängigkeiten muss heute ein e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1af2fd82a6e52adf8ba8738cc960576a
https://doi.org/10.3139/104.101322
https://doi.org/10.3139/104.101322
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Wire bond degradation is a limiting factor for the lifetime of state of the art power modules. So, there is a need for widely applicable and proven modelling techniques to achieve a reliable design. In this paper, a new crack growth law has been deve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f03de509f826457cadbea65f401e461b
https://doi.org/10.1109/eurosime.2015.7103091
https://doi.org/10.1109/eurosime.2015.7103091
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Reliability of electronic systems is finally limited due to thermo-mechanical fatigue of interconnections. Besides soldered interconnections wire bonding is one of the most commonly used interconnection technology in electronics. Due to thermo-mechan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73a436df2ca6b56a0fdd343c7a77b7e9
https://doi.org/10.1109/ectc.2014.6897275
https://doi.org/10.1109/ectc.2014.6897275
Autor:
Olaf Wittler, Tobias Prewitz, Stefan Schmitz, Arian Grams, Andreas Middendorf, Klaus-Dieter Lang
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this study, an approach for enhanced lifetime modelling of wire bonds has been investigated. Numerical simulations of a 3D wire bond model have been used to acquire a suitable damage parameter. For the lifetime model, a modified Paris law for calc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ea330ee57805f60482d7fef76139450
https://doi.org/10.1109/eurosime.2014.6813828
https://doi.org/10.1109/eurosime.2014.6813828
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04a391016f049cd3caac4ddd69fc35fc
https://doi.org/10.1109/icep.2014.6826732
https://doi.org/10.1109/icep.2014.6826732
Autor:
J. Kripfgans, Olaf Wittler, T. Prewitz, Wolfgang H. Müller, K-D. Lang, Andreas Middendorf, Arian Grams, Stefan Schmitz
Publikováno v:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this study possibilities are investigated to use the cohesive zone method for numerical calculation of fatigue crack growth through the interface area of aluminum thick wire bond joints. For that purpose a detailed three-dimensional model of a wir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ef19d5b1f0dbb844b557f15fd38ddd2
https://doi.org/10.1109/eurosime.2013.6529961
https://doi.org/10.1109/eurosime.2013.6529961
Publikováno v:
Design for Innovative Value Towards a Sustainable Society ISBN: 9789400730106
Over the past years a new concept has evolved to combine eco-optimization with reliability aspects. As a short phrase we have coined the word eco-reliability, which we would like to explain and explore in the following paper.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ef06de9504f1436d795d2a135f10f43
https://doi.org/10.1007/978-94-007-3010-6_78
https://doi.org/10.1007/978-94-007-3010-6_78
