Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Andreas Gneupel"'
Publikováno v:
Materials Science in Semiconductor Processing. 67:124-140
In this work, we investigate finite element models of an imprinting scenario of a needle into a thin metallic film together with corresponding experiments in order to analyze the critical conditions that lead to brittle fracture in Back End Of Line (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b3242a021f9c2617b52259704a27dd8
https://doi.org/10.1016/j.mssp.2017.05.020
https://doi.org/10.1016/j.mssp.2017.05.020
