Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Andreas Bertz"'
Autor:
Jan-Eric Ehlers, Henning Menzel, Heike Bunjes, Andreas Bertz, Stefanie Wöhl-Bruhn, Karl-Heinz Gericke
Publikováno v:
Macromolecular Bioscience. 13:215-226
Modified hydroxyethyl starch is photo-crosslinked in the presence of a green fluorescent protein (GFP) (mTagGFP) to obtain loaded hydrogels as model for a drug-delivery system. An important factor for the protein release is the crosslinking density s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fe173ee14de7b62fe9ff7372253b080
https://doi.org/10.1002/mabi.201200325
https://doi.org/10.1002/mabi.201200325
Publikováno v:
European Journal of Pharmaceutics and Biopharmaceutics. 81:573-581
Hydrogels are promising delivery systems for the controlled release of biomacromolecules. Based on previous studies, hydrogels were prepared from crosslinkable hydroxyethyl starch with new linker groups to improve mechanical and release properties of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09fbbd8b30056c7934d204e7246f3c5d
https://doi.org/10.1016/j.ejpb.2012.04.017
https://doi.org/10.1016/j.ejpb.2012.04.017
Autor:
Muhammad Badar, Stefanie Wöhl-Bruhn, Henning Menzel, Brigitte Tiersch, Heike Bunjes, Peter P. Mueller, Andreas Bertz, Joachim Koetz
Publikováno v:
Journal of Controlled Release. 162:127-133
Hydrogel systems based on hydroxyethyl starch-polyethylene glycol methacrylate (HES-P(EG)(6)MA) or hydroxyethyl starch methacrylate (HES-MA) were used to assess the protein release behavior. Here, we analyzed the in vitro release of FITC-anti-human a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9a18defd6f1433c7336b3833fb333401
https://doi.org/10.1016/j.jconrel.2012.05.049
https://doi.org/10.1016/j.jconrel.2012.05.049
Publikováno v:
ECS Transactions. 27:295-300
As a result of the growing complexity and miniaturization of innovative products systems integration is becoming more and more important for scientific and technical development. The micro and nano system technologies as well as electronics are playi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::608c18b539133b2b7f9a9a1cf1fbaa85
https://doi.org/10.1149/1.3360635
https://doi.org/10.1149/1.3360635
Publikováno v:
Sensors and Actuators A: Physical. :316-322
This paper reports on a new method for thin film encapsulation of microelectromechanical systems (MEMS) using plasma enhanced chemical vapor deposited (PECVD) fluorocarbon polymer as sacrificial material and a stress optimized SiO/SiN/Al capping laye
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbe5fbd5a7064a9ad7d32fa3a10c70aa
https://doi.org/10.1016/j.sna.2007.11.002
https://doi.org/10.1016/j.sna.2007.11.002
Autor:
Danny Reuter, Detlef Billep, Wolfram Dötzel, S. Buschnakowski, Thomas Gessner, Andreas Bertz, Dirk Scheibner
Publikováno v:
Sensors and Actuators A: Physical. 126:211-217
This paper presents a MEMS fabrication technique for reducing the trench width of microstructures below the technological limitations of the deep reactive ion etching (DRIE) process, in order to increase the aspect ratio of the sensing electrode gap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::99524e9e72d78d5f2a6b6c2a6b54d498
https://doi.org/10.1016/j.sna.2005.09.033
https://doi.org/10.1016/j.sna.2005.09.033
Autor:
Christian Wenzel, Johann W. Bartha, D. Zeidler, Thomas Gessner, Stefan E. Schulz, Andreas Bertz, J.-W. Erben, Matthias Uhlig
Publikováno v:
Microelectronic Engineering. 70:314-319
The integration of ultra low k materials in copper damascene architecture is one of the main issues in finding microelectronic-process-compatible dielectric materials. The aim of this paper is to show the integration conformity with common equipment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb7a36ab1b1e66719cef2d2e10d159e6
https://doi.org/10.1016/s0167-9317(03)00415-5
https://doi.org/10.1016/s0167-9317(03)00415-5
Autor:
Thomas Gessner, A. Höffer, K. Stegemann, K. Griesbach, Andreas Bertz, H. Symanzik, G. Ebest, C. Steiniger
Publikováno v:
Sensors and Actuators A: Physical. 93:163-172
The monolithic integration of electronic circuits in standard CMOS technology with high aspect ratio micromechanical structures based on single-crystal silicon is presented. For this technology neither silicon on insulator (SOI) wafers nor wet proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7ff25b550288986878fd84602147964
https://doi.org/10.1016/s0924-4247(01)00650-1
https://doi.org/10.1016/s0924-4247(01)00650-1
Publikováno v:
Microelectronic Engineering. 50:7-14
New intermetal dielectrics with dielectric constants (k) less than the dielectric constant of the conventionally used SiO2 (k=3.9) are required for the fabrication of low voltage integrated circuits due to their ability to decrease signal delay time,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8024318abe2cb8c4f7390e43a7a3288a
https://doi.org/10.1016/s0167-9317(99)00258-0
https://doi.org/10.1016/s0167-9317(99)00258-0
Publikováno v:
Microelectronic Engineering. 35:333-336
As a consequence of the well-known difficulties in reactive dry Cu patterning only a small number of processes has been published world-wide. Using a simple Cl2 based chemistry including an intense ion bombardment as an alternative approach, the form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecb3e0e9fa60eff855c939b72d386067
https://doi.org/10.1016/s0167-9317(96)00138-4
https://doi.org/10.1016/s0167-9317(96)00138-4