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pro vyhledávání: '"Andrea M. Chacko"'
Autor:
Yichen Liang, Kelsey E. Brakensiek, Joyce Lowes, Andrea M. Chacko, Ruimeng Zhang, Veerle Van Driessche, Xiaolong Lang, Jaishankar Kasthuri, Ming Luo, Douglas J. Guerrero
Publikováno v:
Advances in Patterning Materials and Processes XXXIX.
Publikováno v:
Advances in Patterning Materials and Processes XXXVII.
Extreme ultraviolet (EUV) lithography has gained momentum towards high-volume manufacturing (HVM) as the method of choice for sub-20 nm half-pitch device fabrication. Optimized EUV photoresists and an improved understanding of the EUV patterning mech