Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Andras Vass-Varnai"'
Autor:
Utsav Gupta, Andras Vass-Varnai
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In today’s day and age, power electronic components are found in all areas of an electric vehicle, from power train to motors and from battery to ancillary loads. Power converters are used to optimize energy management in an automobile. While doing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84e574ac6bc8e4fdb0dc9ec08d5bd176
https://doi.org/10.1115/ipack2022-97669
https://doi.org/10.1115/ipack2022-97669
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a23ce842cc2ea4c3840e24d2f4c3256d
https://doi.org/10.1109/therminic52472.2021.9626508
https://doi.org/10.1109/therminic52472.2021.9626508
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c5bd44a4872e48fd59c2bbbf6353846
https://doi.org/10.1109/therminic52472.2021.9626498
https://doi.org/10.1109/therminic52472.2021.9626498
Autor:
Yong Seoung Lee, Young Joon Cho, Voon Hon Wong, Kwon Hyung Lee, Andras Vass-Varnai, Antonio Caruso
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b90e57cdc0de6f67d647cc54eacb3d4
https://doi.org/10.1109/ipfa53173.2021.9617427
https://doi.org/10.1109/ipfa53173.2021.9617427
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
A modeling methodology to speed up the design of luminaires composed of solid state light emitting devices has been elaborated in the Delphi4LED research project of the European Union. Starting with integrated and automated measurements of packaged L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f622aa44e9514eb3c132a4bf300b822f
https://doi.org/10.1115/ipack2019-6547
https://doi.org/10.1115/ipack2019-6547
Publikováno v:
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia).
To determine the thermal properties of power semiconductor devices and structures, the JEDEC JESD 51-1 static, electrical test method is a well-known and industry-wide accepted technique. The approach provides accurate and repeatable results in case
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e932a66e1447eb8c8ac148c7e788b977
https://doi.org/10.23919/ipec.2018.8507995
https://doi.org/10.23919/ipec.2018.8507995
Publikováno v:
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Imposing a step change in power dissipation to a packaged semiconductor and measurement of the resulting thermal response of a temperature sensitive parameter in time is a well-established testing method. This thermal response can be processed so as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05abaa38b27b4664802455377c539fda
https://doi.org/10.1109/semi-therm.2018.8357361
https://doi.org/10.1109/semi-therm.2018.8357361
Publikováno v:
International Heat Transfer Conference 16.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04db97db31b633f9850fa2d124b7a843
https://doi.org/10.1615/ihtc16.ctm.024314
https://doi.org/10.1615/ihtc16.ctm.024314
Autor:
Balázs Plesz, Andras Vass-Varnai
Publikováno v:
Microelectronics Journal. 45:1710-1715
The current paper deals with the application of thermal transient testing as a characterization tool for solar modules. Based on the measurement of different samples (concentrator solar cell, single junction silicon solar cell) we prove the applicabi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b31ade3b4f64126e51a0e0916ac7cb54
https://doi.org/10.1016/j.mejo.2014.06.003
https://doi.org/10.1016/j.mejo.2014.06.003
Publikováno v:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Classical approaches to the 3D thermal simulation of electronic systems require assumptions regarding the amount of power dissipated and its distribution. Errors in such assumptions are a leading cause of resulting errors in temperature rise predicti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff3dec8231216041884ad0b8bfaa18a
https://doi.org/10.1109/semi-therm.2017.7896904
https://doi.org/10.1109/semi-therm.2017.7896904