Zobrazeno 1 - 10
of 54
pro vyhledávání: '"André Van Calster"'
Autor:
Alexis de Vos, André van Calster
Publikováno v:
Active and Passive Electronic Components, Vol 6, Iss 3-4, Pp 131-134 (1980)
Externí odkaz:
https://doaj.org/article/626370ffbf424b11bcedd32e60795419
Autor:
Pankaj Joshi, Herbert De Smet, Xiaobing Shang, Jelle De Smet, Dieter Cuypers, André Van Calster
Publikováno v:
Journal of the Society for Information Display. 22:457-464
In reflective liquid crystal devices that have an asymmetric electrode structure, an internal cell voltage is often present that interferes with the proper functioning of the device. Contrary to transmissive devices, this internal voltage cannot be a
Autor:
Tim Desmet, Sandra Van Vlierberghe, Johan De Baets, Etienne Schacht, David Schaubroeck, André Van Calster
Publikováno v:
Applied Surface Science. 255:8780-8787
The introduction of amine groups on the surface of dielectric resins improves the adhesion with electrochemically deposited metals. In this work, etched epoxy resin surfaces are modified with aliphatic amines via a two step wet chemical reaction appr
Publikováno v:
Applied Surface Science. 252:2717-2740
Advanced printed circuit boards (PCBs) with sequential build-up (SBU) layers require alternating dielectric and copper layers on top of a core substrate. This can be achieved by lamination of resin coated copper (RCC) or by coating of dielectric poly
Publikováno v:
Thin Solid Films. 495:348-356
Wet-chemical surface synthesis reactions were performed on thin epoxy layers for usage as a build-up layer in microelectronics. The synthesis reactions, based on heterocyclic organic coupling agents, were used to imprint iminodiacetic acid and imidaz
Publikováno v:
Applied Surface Science. 245:353-368
Polymer coatings used as build-up layers in advanced printed circuit boards (PCBs) are usually applied through curtain coating or lamination for industrial purposes. Dip coating can be used as an easier and cheaper way of applying a build-up layer, i
Publikováno v:
Microelectronics Reliability. 45:675-687
The plating quality results of high-aspect ratio through holes in industrially produced and sized printed circuit boards are reported in this paper. Test panels with 32,000 PTHs were processed on an existing industrial production line in order to tes
Publikováno v:
Applied Surface Science. 237:457-462
The adhesion of plated metal layers to polymer surfaces is of prime importance for the reliability of interconnections in electronics. An increase in the roughness of the polymer surface, caused by chemical treatment, plays an important part in the a
Autor:
Geert P. S. Van Doorselaer, Dieter Cuypers, Jean Van den Steen, André Van Calster, Herbert De Smet
Publikováno v:
Displays. 23:89-98
The design, fabrication and evaluation of a high-performance 0.9 in. diagonal XGA microdisplay is described. The DRAM type active matrix comprises square pixels with a 17.6 μm pitch. Bi-directional row and column drivers are integrated on-chip. A 4-
Publikováno v:
Liquid Crystals. 28:1245-1252
In general this reduction of the cell gap improves the electro-optic properties of a polymer dispersed liquid crystal (PDLC) in reflective microdisplays. At the interface between the PDLC film and the silicon backplane or cover glass, the LC molecule