Zobrazeno 1 - 10
of 41
pro vyhledávání: '"André Clausner"'
Autor:
Kristina Kutukova, Bartlomiej Lechowski, Joerg Grenzer, Peter Krueger, André Clausner, Ehrenfried Zschech
Publikováno v:
Nanomaterials, Vol 14, Iss 5, p 448 (2024)
High-resolution imaging of Cu/low-k on-chip interconnect stacks in advanced microelectronic products is demonstrated using full-field transmission X-ray microscopy (TXM). The comparison of two lens-based laboratory X-ray microscopes that are operated
Externí odkaz:
https://doaj.org/article/e9b7f566572f40d298892183e55b6b42
Publikováno v:
MethodsX, Vol 10, Iss , Pp 102028- (2023)
For micromechanical robustness evaluation methods, it is advantageous if the mechanical loading conditions applied can be controlled as precisely as possible. For microchips, this is required to determine the robustness under specific conditions, e.g
Externí odkaz:
https://doaj.org/article/99f0bac18e8342a5aef66bea8a0e8bf2
Publikováno v:
Materials & Design, Vol 221, Iss , Pp 110946- (2022)
An experimental approach to control the fracture behavior of 3D nanopatterned structures in real time and to describe the microcrack propagation in solids quantitatively is presented. The three-dimensional details of the complicated failure mechanism
Externí odkaz:
https://doaj.org/article/98f46a08d6c742539c0e8c13ec47340c
Autor:
Qiong Li, Jürgen Gluch, Zhongquan Liao, Juliane Posseckardt, André Clausner, Magdalena Łępicka, Małgorzata Grądzka-Dahlke, Ehrenfried Zschech
Publikováno v:
Nanomaterials, Vol 11, Iss 6, p 1615 (2021)
Fossil frustules of Ellerbeckia and Melosira were studied using laboratory-based nano X-ray tomography (nano-XCT), transmission electron microscopy (TEM) and energy-dispersive X-ray spectroscopy (EDS). Three-dimensional (3D) morphology characterizati
Externí odkaz:
https://doaj.org/article/1347a2a3eef54ab9b65cb8c852d3fa7d
Autor:
Emre Topal, Harishankaran Rajendran, Izabela Zgłobicka, Jürgen Gluch, Zhongquan Liao, André Clausner, Krzysztof Jan Kurzydłowski, Ehrenfried Zschech
Publikováno v:
Nanomaterials, Vol 10, Iss 5, p 959 (2020)
Diatom frustules, with their hierarchical three-dimensional patterned silica structures at nano to micrometer dimensions, can be a paragon for the design of lightweight structural materials. However, the mechanical properties of frustules, especially
Externí odkaz:
https://doaj.org/article/d6078235339944fd85f412d607cd7be9
Autor:
Martyna Strąg, Łukasz Maj, Magdalena Bieda, Paweł Petrzak, Anna Jarzębska, Jürgen Gluch, Emre Topal, Kristina Kutukova, André Clausner, Wieland Heyn, Katarzyna Berent, Kinga Nalepka, Ehrenfried Zschech, Antonio G. Checa, Krzysztof Sztwiertnia
Publikováno v:
Nanomaterials, Vol 10, Iss 4, p 634 (2020)
The mechanical properties such as compressive strength and nanohardness were investigated for Pinctada margaritifera mollusk shells. The compressive strength was evaluated through a uniaxial static compression test performed along the load directions
Externí odkaz:
https://doaj.org/article/902ce1a69fe247eca880cee0bc7ef96c
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
In this article, the filler distribution in an epoxy molding compound (EMC), used in IC packaging, is studied across a wafer using high-resolution X-ray computed tomography (HR-XCT). It is widely assumed that the fillers are uniformly distributed acr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9a90f755c4bc12768971b5dea6465c26
https://doi.org/10.1109/tcpmt.2020.3048672
https://doi.org/10.1109/tcpmt.2020.3048672
Autor:
S. Schlipf, Ehrenfried Zschech, André Clausner, Jens Paul, Laura Wambera, Karsten Meier, Simone Capecchi
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:9-16
The strain impact on integrated circuit performance is investigated by applying a novel indentation technique. The approach aims to investigate stress caused by CPI, particularly highly localized stress/strain with respect to the actual device geomet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0578d3552d6342df5fd9bb7cf10edc2a
https://doi.org/10.1109/tdmr.2020.3041349
https://doi.org/10.1109/tdmr.2020.3041349
Autor:
André Clausner, Ehrenfried Zschech, Johannes Zechner, Klaus Goller, Wieland Heyn, Sergey Ananiev, Hanno Melzner
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc1dfb49b823a9f355b118196f6278b0
https://doi.org/10.1109/ipfa53173.2021.9617276
https://doi.org/10.1109/ipfa53173.2021.9617276
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24a16877323e846afca3b2c15bd1e982
https://doi.org/10.1109/ipfa53173.2021.9617313
https://doi.org/10.1109/ipfa53173.2021.9617313