Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Amit K. Sarkhel"'
Autor:
Ny. Charles Goldsmith, W. Henderson, Karl J. Puttlitz, Amit K. Sarkhel, Won Kyoung Choi, Da-Yuan Shih, Sung K. Kang, Ny. Donald, Timothy A. Gosselin
Publikováno v:
JOM. 55:61-65
Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d82233e3e8d4b0339616cf254a2d4a68
https://doi.org/10.1007/s11837-003-0143-6
https://doi.org/10.1007/s11837-003-0143-6
Autor:
Won-Kyoung Choi, Karl J. Puttlitz, Sung K. Kang, Timothy A. Gosselin, Charles C. Goldsmith, Amit K. Sarkhel, Da-Yuan Shih, Donald W. Henderson
Publikováno v:
Journal of Materials Research. 17:2775-2778
Near-ternary eutectic Sn–Ag–Cu alloys are leading candidates for Pb-free solders. These alloys have three solid phases: β–Sn, Ag3Sn, and Cu6Sn5. Starting from the fully liquid state in solidifying near-eutectic Sn–Ag–Cu alloys, the equilib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f5581f616dda32da1b955e00e0d9f77
https://doi.org/10.1557/jmr.2002.0402
https://doi.org/10.1557/jmr.2002.0402
Autor:
Donald W. Henderson, Karl J. Puttlitz, D.-Y. Shih, M.J. Griffin, Myung-Jin Yim, Keith E. Fogel, Sung K. Kang, D.E. King, Amit K. Sarkhel, Timothy A. Gosselin, J.J. Konrad, Gerald G. Advocate, Charles C. Goldsmith, Paul A. Lauro
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 25:155-161
Recently, the research and development activities for replacing Pb-containing solders with Pb-free solders have been intensified due to both competitive market pressures and environmental issues. As a result of these activities, a few promising candi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::148d2754397968d1a677e63d0390699c
https://doi.org/10.1109/tepm.2002.801165
https://doi.org/10.1109/tepm.2002.801165
Autor:
Sung K. Kang, Amit K. Sarkhel
Publikováno v:
Journal of Electronic Materials. 23:701-707
The harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. At present, Sn-Pb eutectic and other Pb-containing so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61cf476a27365561302e5f1a282b6038
https://doi.org/10.1007/bf02651362
https://doi.org/10.1007/bf02651362
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Flip-chip carriers have become the preferred solution for high-performance ASIC and microprocessor devices. Typically these are packaged in organic or ceramic Ball Grid Array (BGA) packages. IBM has developed both Ceramic Ball Grid Array (CBGA) and C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28d29b3bb2e035f091254ecc41b91880
https://doi.org/10.1109/ectc.2001.927927
https://doi.org/10.1109/ectc.2001.927927