Zobrazeno 1 - 10
of 153
pro vyhledávání: '"Amirkhany, A."'
Autor:
Tianyu Wang, Da Wei, Ranick Ng, Gaurav Malhotra, Anup P. Jose, Amir Amirkhany, Pavan Kumar Hanumolu
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:2521-2531
Autor:
Dongwon Park, Jongman Bae, Hyunsu Kim, Amir Amirkhany, Anup Jose, Frank Seto, Dale Stolitzka, Kyungyoul Min, Wonjun Choe
Publikováno v:
SID Symposium Digest of Technical Papers. 53:159-162
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:3-5
Autor:
Amir Amirkhany
Publikováno v:
IEEE Solid-State Circuits Magazine. 12:25-38
The choice of clock and data recovery (CDR) architecture in serial links dictates many of the blocklevel circuit specifications (specs). Block-level specs ultimately determine the energy efficiency of the system. Therefore, to design energy-efficient
Akademický článek
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Publikováno v:
Majallah-i Dānishgāh-i ̒Ulūm-i Pizishkī-i Bābul, Vol 10, Iss 2, Pp 56-61 (2008)
BACKGROUND AND OBJECTIVE: Cryptosporidium and isospora are opportunistic and zoonotic protozoan parasites and they can cause chronic and self-limiting gastroenteritis in immunocompetent individuals and acute gastroenteritis in immunocompromised patie
Externí odkaz:
https://doaj.org/article/8577e75db6354bc3ad9865d5a4a08ff4
Publikováno v:
2021 55th Asilomar Conference on Signals, Systems, and Computers.
Publikováno v:
Journal of International Business and Economy. 20:1-27
This research investigates effects of host country corruption and formal and informal institutional restrictiveness on the entry strategies of foreign multinational enterprises. Using data of over 400 telecommunication projects in developing markets
Autor:
Valentin Abramzon, Amir Amirkhany, Wei Xiong, Michael Wang, Jose Anup P, Elzeftawi Mohamed, Young-Hoon Song, Shiva Moballegh, Jalil Kamali, Kyunglok Kim
Publikováno v:
SID Symposium Digest of Technical Papers. 50:334-337
Publikováno v:
ISSCC
High-performance SerDes with both high area efficiency (mm2/lane) and energy efficiency (pJ/b) are driven by the ever-increasing demands of bandwidth and capacity in data centers. They also enable chiplets, multi-die, and silicon-photonics integratio