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pro vyhledávání: '"Amir Hosein Kokabi"'
Autor:
Javad Sajedifar, Amir Hosein Kokabi, Kamal Azam, Somayeh Farhang, Ali Karimi, Farideh Golbabaei
Publikováno v:
بهداشت و ایمنی کار, Vol 6, Iss 4, Pp 17-26 (2016)
Introduction: Nowadays, Shielded Metal Arc Welding (SMAW) is the most widely used arc welding. During the welding operation, typically, various harmful agents such as fumes, gases, heat, sound and ultraviolet radiation are produced of which fume is t
Externí odkaz:
https://doaj.org/article/8e81587de18e424eba8d09827fbef2dd
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 228:413-421
In this study, a three-dimensional model has been utilized for predicting thermal responses during tungsten arc welding of AA2024-T4 plates in which double ellipsoidal heat source model was employed to consider the moving torch in the model. Furtherm
Autor:
Fardin Nematzadeh, Seyed Khatiboleslam Sadrnezhaad, Amir Hosein Kokabi, Soroush Parvizi, Mohammad Reza Akbarpour
Publikováno v:
Materials & Design (1980-2015). 36:94-99
In the present research, different weld layers were deposited on a 1.2714 steel die by gas tungsten arc (GTA) welding with the weld wire of Udimet 520, and effects of welding parameters on microstructure and mechanical properties of Udimet 520 supera
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 55:649-656
In the present study, a thermo-elastic–plastic model was developed in order to evaluate the residual stresses in dissimilar automatic tungsten inert gas (TIG) welds between plain carbon steel CK4 and a ferritic stainless steel AISI409. The effect o
Autor:
Ali Roshanghias, Samjid H. Mannan, Amir Hosein Kokabi, M.P. Clode, Hiren Kotadia, Omid Mokhtari, Farzad Khomamizadeh, Roya Ashayer, Mark Miodownik
Publikováno v:
MRS Proceedings. 1424
Due to environmental concerns traditional eutectic tin-lead solder is gradually being replaced in electronic assemblies by “lead-free” solders. During this transition, nanoparticle technology is also being investigated to see whether improvements
Autor:
Farzad Khomamizadeh, Ali Roshanghias, Samjid H. Mannan, Roya Ashayer, M.P. Clode, Omid Mokhtari, Amir Hosein Kokabi, Mark Miodownik, Hiren Kotadia
Publikováno v:
Journal of Electronic Materials. 41(7):1907-1914
The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within s