Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Amir Charif"'
Autor:
benider, Abdellatif, El-hamouchi, Adil, Sonia, AIT YOUNES, Kahla, Alia Ben, Abdelmalik, AMIMER, Zine, AMIR, charif, Jaballah, Amira, Louiza, Amira, GIHBID, Amina, Achouak, BACHIR, Djihad, BELABDI, Said, BELHADEF, Rafika, BELNOUI, Ayed, Belarbi, Nadia, Benchakroune, Nadia, Benchakroun, Meriem, BENINAL, Radja, BENKALI, Asma, BENSIHAMDI, Hichem, BENYOUCEF, Thouraya, BENDIMRED, Nadir, Bensouf, Rafika, BENNOUI, Yosra, Berrazegua, Latefa, Biskri, Saida, BOUAOUNI, Meriem, BOUANIKA, Abderezzak, Bouamra, Hanen, Bouaziz, Zohra, Boudinar Fatma, Sabrina, Bouhara, Nadir, Boussouf, Saber, Boutayeb, Adda, BOUNEDJAR, Omar, Chabati, Cherine, Charfeddine, Dalia, Chilla, Mehemmai, Chiraz, Bouabid, Cyrine, Souad, Dahnane, Soraya, DIAB, Adlane, Dib Hocine, Wider, Dorra, Fawzi, DERRAR, Amina, ELKEBOUB, Hicham, EL ATTAR, Elmostafa, EL FAHIME, Djazia, ELHADEF, Fehri, Emna, Hakkou, Farid, Hadjam, Farida, Mamboisse, Fanny, Widad, GAIS, Merzak, GHARNAOUT, Nidhal, Guessoum Amir, Farida, HADJAM, SAHRAOUI, HADJ, Rachdi, Haifa, Yaiche, Hamza, Leila, HANNACHI, Mahfouf, Hassan, Bouguerra, Hend, Attar, Hicham El, Hassine, Hichem Ben, Filali, Houda, Harmak, Houda, Kanaane, Houda, Benamri, Ichrak, Alami, Imane El, Reda, KASSA, Bendahhou, Karima, Errafii, Khaoula, Bairi, Khalid El, Wafaa, Khaali, Mehdi, KARKOURI, Maria, Kabbage, Wafa, Kammoun, Houda, Kanaane, Reda, Kassa, Narimane, LAOUAR, Biskri, Latefa, Amira, Louiza, Marie, Louise, Chevalier, Charion, Nabila, MALOUM, Monot, Marc, Saadi, Mariem, Campone, Mario, Mrad, Mehdi, KARKOURI, MEHDI, Mohamed, MELIZI, Saadi, Meriem, CHAHER, Meriem, Ardhaoui, Monia, TALEB, Mourad, Jmiaa, Nadia Ben, Benchakroun, Nadia, Hadhri, Najet, SALHI, Nawel, Taoufiq, Nezha, Jandoubi, Nouha, Wahiba, OUAHIOUNE, Salima, OULDSLIMANE, BELNOUI, Rafika, Louiza, Rahman Amira, Benkhalifa, Rym, Boutaib, Saber, Boutayeb, Saber, Menif, Samia, OULDSLIMANE, Salima, Valcke, Samuel, Assia, SLIMANI, Nasr, Sonia Ben, Maatoug, Sonia, Younes, Sonia Ait, BENCHEHIDA, Souad, BEKOUACI, Souad, Sahraoui, Souha, Hassiba, Tali Maamar, Soraya, Talha, Mourad, TALEB, Fella, TERKMANI, Soraya, TALHA, Wassila, TOUISI, Kammoun, Wafa, OUAHIOUNE, Wahiba, Berrazegua, Yosra, Amel, ZEMMOUR, Sarah, ZEROUAL, AMIR, Zine Charif, Zouafi, Zineb, Hamdi, Yosr, Boujemaa, Maroua, Ben Aissa-Haj, Jihenne, Radouani, Fouzia, Khyatti, Meriem, Mighri, Najah, Hannachi, Mariem, Ghedira, Kais, Souiai, Oussema, Hkimi, Chaima, Kammoun, Mohamed Selim, Mejri, Nesrine, Bouaziz, Hanen, Beloufa, Mohamed Amine, Charoute, Hicham, Barakat, Abdelhamid, Najjar, Imène, Taniguchi, Hiroaki, Pietrosemoli, Natalia, Dellagi, Koussay, Abdelhak, Sonia, Boubaker, Mohamed Samir, Chica, Claudia, Rouleau, Etienne
Publikováno v:
In Translational Oncology June 2024 44
Publikováno v:
System Engineering for constrained embedded systems.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36bb7635b72a26828bb46b76175999b4
https://doi.org/10.1145/3522784.3522796
https://doi.org/10.1145/3522784.3522796
Publikováno v:
IEEE Transactions on Nanotechnology. 18:806-818
Three-dimensional networks on chip (3D-NoCs) have been proposed as an enormously scalable solution to address communication problems in modern systems on chip. Through-silicon via (TSV) is usually adopted as a viable technology enabling vertical conn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18918aef09fa94297037bb4a6efcc47a
https://doi.org/10.1109/tnano.2019.2931271
https://doi.org/10.1109/tnano.2019.2931271
Autor:
Marius Feldmann, Amir Charif, Juan A. Fraire, Scott Burleigh, Pablo G. Madoery, Raoul Velazco, Jorge M. Finochietto, Nacer-Eddine Zergainoh
Publikováno v:
Journal of Computer Networks and Communications, Vol 2017 (2017)
Journal of Computer Networks and Communications
Journal of Computer Networks and Communications, Hindawi Publishing Corporation, 2017, 2017, pp.1-18. ⟨10.1155/2017/2830542⟩
CONICET Digital (CONICET)
Consejo Nacional de Investigaciones Científicas y Técnicas
instacron:CONICET
Journal of Computer Networks and Communications
Journal of Computer Networks and Communications, Hindawi Publishing Corporation, 2017, 2017, pp.1-18. ⟨10.1155/2017/2830542⟩
CONICET Digital (CONICET)
Consejo Nacional de Investigaciones Científicas y Técnicas
instacron:CONICET
Existing Internet protocols assume persistent end-to-end connectivity, which cannot be guaranteed in disruptive and high-latency space environments. To operate over these challenging networks, a store-carry-and-forward communication architecture call
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b264abeada97b4bbea626a38dd1d18eb
https://doi.org/10.1155/2017/2830542
https://doi.org/10.1155/2017/2830542
Autor:
Salah Eddine Saidi, Pierre-Guillaume Le Guay, Amir Charif, Henrique Vicente Souza, Nicolas Ventroux, Tanguy Sassolas
Publikováno v:
RSP
The design of Cyber-Physical Systems is becoming challenging due to their growing complexity. Simulation has proven to be effective for design validation of such complex systems at low cost. In particular, virtual prototyping allows early validation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da2fd1de85746264e10986f8bd379a29
https://doi.org/10.1145/3339985.3358488
https://doi.org/10.1145/3339985.3358488
Publikováno v:
The Conference on Design and Architectures for Signal and Image Processing 2019 (DASIP 2019)
The Conference on Design and Architectures for Signal and Image Processing 2019 (DASIP 2019), Oct 2019, Montreal, Canada
DASIP
The Conference on Design and Architectures for Signal and Image Processing 2019 (DASIP 2019), Oct 2019, Montreal, Canada
DASIP
International audience; As the System-on-Chip (SoC) complexity increases, hardware/software co-design plays an important role to improve design productivity, reduce time to market, and optimize the overall results. Consequently, there is a high inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bdbd5ad1218b8ddf5d9ed16869aaf565
https://hal-cea.archives-ouvertes.fr/cea-02494007/document
https://hal-cea.archives-ouvertes.fr/cea-02494007/document
Publikováno v:
RAPIDO2019-11th Workshop on Rapid Simulation and Performance Evaluation: Methods and Tools
RAPIDO2019-11th Workshop on Rapid Simulation and Performance Evaluation: Methods and Tools, Jan 2019, Valence, Spain. pp.1-8, ⟨10.1145/3300189.3300192⟩
RAPIDO
RAPIDO2019-11th Workshop on Rapid Simulation and Performance Evaluation: Methods and Tools, Jan 2019, Valence, Spain. pp.1-8, ⟨10.1145/3300189.3300192⟩
RAPIDO
International audience; Virtual Prototyping has been widely adopted as a cost-effective solution for early hardware and software co-validation. However, as systems grow in complexity and scale, both the time required to get to a correct virtual proto
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b13df1f48b8d3a9047d83125078fa90
https://hal.science/hal-02023805/file/rapido_2019_CEA_COPYRIGHT_DOI.pdf
https://hal.science/hal-02023805/file/rapido_2019_CEA_COPYRIGHT_DOI.pdf
Publikováno v:
Ad Hoc Networks
Ad Hoc Networks, Elsevier, 2018, 80, pp.31-40. ⟨10.1016/j.adhoc.2018.07.002⟩
Ad Hoc Networks, Elsevier, 2018, 80, pp.31-40
Ad Hoc Networks, Elsevier, 2018, 80, pp.31-40. ⟨10.1016/j.adhoc.2018.07.002⟩
Ad Hoc Networks, Elsevier, 2018, 80, pp.31-40
Delay-Tolerant Networking (DTN) has been proposed for satellite networks with no expectation of continuous or instantaneous end-to-end connectivity, which are known as Delay-Tolerant Satellite Networks (DTSNs). Path computation over large and highly-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7dc72c971cc69a659d85ae0cbb03dd5e
https://www.sciencedirect.com/science/article/pii/S1570870518304359
https://www.sciencedirect.com/science/article/pii/S1570870518304359
Publikováno v:
DFT
IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT 2018)
IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT 2018), Oct 2018, Chicago, United States. pp.1-6
IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT 2018)
IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT 2018), Oct 2018, Chicago, United States. pp.1-6
Three-dimensional Networks-on-Chip (3D-NoC) have emerged as an effective solution to the scalability and latency issues in modern complex System-On-Chips. Through-Silicon Via (TSV) is usually adopted as a viable technology enabling vertical connectio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9fdace2987fe88e6d22701b8ec77c11e
https://doi.org/10.1109/dft.2018.8602971
https://doi.org/10.1109/dft.2018.8602971
Autor:
Nader Bagherzadeh, Nacer-Eddine Zergainoh, Masoumeh Ebrahimi, Alexandre Siqueira Guedes Coelho, Amir Charif
Publikováno v:
IEEE Transactions on Computers
IEEE Transactions on Computers, Institute of Electrical and Electronics Engineers, 2018, 67 (10), pp.1430-1444. ⟨10.1109/TC.2018.2822269⟩
IEEE Transactions on Computers, 2018, 67 (10), pp.1430-1444. ⟨10.1109/TC.2018.2822269⟩
IEEE Transactions on Computers, Institute of Electrical and Electronics Engineers, 2018, 67 (10), pp.1430-1444. ⟨10.1109/TC.2018.2822269⟩
IEEE Transactions on Computers, 2018, 67 (10), pp.1430-1444. ⟨10.1109/TC.2018.2822269⟩
International audience; 3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f8b360f7248b902d25d616038657178f
https://hal.archives-ouvertes.fr/hal-01899147
https://hal.archives-ouvertes.fr/hal-01899147