X-Ray Photoelectron Spectroscopy Estimation of Cobalt Seed Layer Reactivity Toward Air Exposure: A Challenge?

Autor: Amine Lakhdari, Vincent Mevellec, Arnaud Etcheberry, Mikailou Thiam, Dominique Suhr, Nathalie Simon, Anne-Marie Goncalves, Frédéric Raynal, Louis Caillard, Mathieu Frégnaux

Publikováno v: ECS Transactions
237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020, 2020, Montreal, Canada. pp.149-156, ⟨10.1149/09701.0149ecst⟩

For the last several generations of CMOS technology, copper has been used widely as an interconnect material in the back end of the line (BEOL). [1] [2] [3] As the current nodes technology are decreasing continuously, several copper scaling challenge

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::82283a0f550fcc1962cf68ca0096e2df
https://doi.org/10.1149/09701.0149ecst

Comparison of Copper and Cobalt Surface Reactivity for Advanced Interconnects

Autor: Amine Lakhdari, Mathieu Frégnaux, Arnaud Etcheberry, Mikailou Thiam, Frédéric Raynal, Louis Caillard, Anne Marie Goncalves

Publikováno v: 2021 IEEE International Interconnect Technology Conference (IITC).

The constant shrinking of critical dimensions in logic manufacturing is driving a change in integration of interconnects. While copper has been the material of choice for the past few decades, it is currently facing a serious challenge from other mat

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::65058ee332e89bc5535c9142449f6f72
https://doi.org/10.1109/iitc51362.2021.9537458