Výsledky vyhledávání - "Allison C. Rector"

Autor: Laura Mauer, Kimberly Dona Pollard, Ramey Youssef, John Taddei, Allison C. Rector

Publikováno v: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001596-001620

3D integration is the most active methodology for increasing device performance. The ability to create Through Silicon Vias (TSV) provides the shortest path for interconnections and will result in increased device speed and reduced package footprint.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::610e5796a2646a5ab82a29cabd0e1a4c
https://doi.org/10.4071/2011dpc-wp14

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Using a Novel Solvent-based Technology to Preserve Low-k Material when Removing Gap Fill Material

Autor: Cole Franklin, Allison C. Rector, Kimberly Dona Pollard, Don Pfettscher, Diane Marie Scheele

Publikováno v: ECS Transactions. 25:117-120

As the technology nodes shrink, device makers are running into barriers with traditional post etch process flows. In the back-end-of-line (BEOL), the porous low-k materials can be damaged by the etch chemistries, the dry ash plasmas and the subsequen

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1701a58cb10bc71f92f050d87c5e7e1
https://doi.org/10.1149/1.3202643

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