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pro vyhledávání: '"Allenyl Chen"'
Autor:
David Tarng, Yung-Da Chiu, Chi-Tsung Chiu, Allenyl Chen, An-Tai Wu, Shiu-Chih Wang, Louis Chen
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind via aspect ratios increase, development of a relia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2201ea7315bde3b488eeeecb00996971
https://doi.org/10.1109/ectc.2019.00219
https://doi.org/10.1109/ectc.2019.00219
