Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Alison Gracias"'
Publikováno v:
2018 IEEE International Interconnect Technology Conference (IITC).
Electrolytic cobalt fill of sub-5 nm node features and a proposed model for the fill mechanism supported by cyclic voltammetry is presented. The transformation of the organic plating additive from an active to a de-activated state at the bottom of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52c268c85eb8af2244f58767f0b78c2b
https://doi.org/10.1109/iitc.2018.8430384
https://doi.org/10.1109/iitc.2018.8430384
Autor:
Gyanaranjan Pattanaik, Peter Reilly, Anh Nguyen, Jack Enloe, Michael Flynn, Alison Gracias, Kevin Fealey, Fred Wafula
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:43-48
This study addresses the impact of bath stability on electroplated copper for through-silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities, and other properties of the copper produced were characterized using an arr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6631544989131d3e371b898c9182a57f
https://doi.org/10.4071/imaps.448
https://doi.org/10.4071/imaps.448
Autor:
Anh Nguyen, Jack Enloe, Fred Wafula, Kevin Fealey, Peter Reilly, Alison Gracias, Gyanaranjan Pattanaik, Michael Flynn
Publikováno v:
International Symposium on Microelectronics. 2014:000013-000018
This study addresses the impact of bath stability on electroplated copper for through silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities and other properties of the copper produced were characterized using an arra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8fa5d5bc7d6376b6d6e74ab2606b181
https://doi.org/10.4071/isom-ta13
https://doi.org/10.4071/isom-ta13
Autor:
Tyler Barbera, Gert J. Leusink, Gyanaranjan Pattanaik, Fred Wafula, Larry Smith, Brian Sapp, Victor Vartanian, Toshio Hasegawa, Steve Golovato, Alison Gracias, Kaoru Maekawa, Shan Hu, Steve Olson, Jack Enloe, Kai-Hung Yu, Klaus Hummler
Publikováno v:
International Symposium on Microelectronics. 2014:000001-000007
SEMATECH evaluated the impact of various process options on the overall manufacturing cost of a TSV module, from TSV lithography and etch through post-plate CMP. The purpose of this work was to understand the cost differences of these options in orde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d12e43b9cb85bf97de970ea10e38478f
https://doi.org/10.4071/isom-ta11
https://doi.org/10.4071/isom-ta11
Autor:
Tyler Barbera, Klaus Hummler, Gyanaranjan Pattanaik, Larry Smith, Gert J. Leusink, Steve Olson, Brian Sapp, Kai-Hung Yu, Shan Hu, Akira Fujita, Alison Gracias, Jack Enloe, Kaoru Maekawa, Kenneth Matthews, Victor Vartanian, Fred Wafula
Publikováno v:
International Symposium on Microelectronics. 2014:000794-000803
Even as unit processes for high aspect ratio (HAR) through silicon via (TSV) mid-wafer front-side processing are becoming relatively mature, scaling of the TSVs and reduction of cost of ownership (COO) drive significant innovations in processes, equi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::847d8b085afbcb5aa5f4947b13ff4eac
https://doi.org/10.4071/isom-thp14
https://doi.org/10.4071/isom-thp14
Publikováno v:
Biomaterials. 32:4498-4505
The ability of embryonic stem (ES) cells to self-renew indefinitely and to differentiate into multiple cell lineages holds promise for advances in modeling disease progression, screening drugs and treating diseases. To realize these potentials, it is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::54840f88ce94342a998a7c0efcd1e7f2
https://doi.org/10.1016/j.biomaterials.2011.03.011
https://doi.org/10.1016/j.biomaterials.2011.03.011
Publikováno v:
physica status solidi (a). 208:684-690
This paper describes the influence of diamond nanoparticles on the modification of the thermal properties of benzocyclobutene (BCB) which is used for three-dimensional (3D) wafer-to-wafer integration. Hybrid nanocomposites containing mixtures of 0.5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6451b6184982eb9fde5d12644bd2f4a7
https://doi.org/10.1002/pssa.201026601
https://doi.org/10.1002/pssa.201026601
Autor:
Roger Quon, Kippei Sugita, Iqbal Ali, Brian Sapp, Robert E. Geer, Kaoru Maekawa, Hiroyuki Hashimoto, Alison Gracias, Christopher O'Connell
Publikováno v:
2012 IEEE International Interconnect Technology Conference.
A study using a vapor deposited polyimide (VDP) dielectric liner to electrically isolate through-silicon vias (TSVs) has demonstrated electrical and thermo-mechanical performance superior to sub-atmospheric chemically vapor deposited (SACVD) tetraeth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::160c9360902ade3ea314ddd6de3ddf09
https://doi.org/10.1109/iitc.2012.6251638
https://doi.org/10.1109/iitc.2012.6251638
Publikováno v:
SPIE Proceedings.
Microfluidic devices are currently being utilized in many types of BioMEMS and medical applications. In these systems, the interaction betwee n the surface and the biological specimen depends critically on surface properties. The surface roughness an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e759812a54e5049b2b007f0d8d41b890
https://doi.org/10.1117/12.807665
https://doi.org/10.1117/12.807665
Publikováno v:
SPIE Proceedings.
Optical interferometry is a well established technique for high resolution displacement measurements. It is commonly used in the semiconductor industry as a sub-system of manufacturing and metrology tools. As the industry progresses, the tools contin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db8d434446f97982060db4e02311071c
https://doi.org/10.1117/12.808043
https://doi.org/10.1117/12.808043