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pro vyhledávání: '"Alikpala J"'
Autor:
Yang SJ; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Dahan MM; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Levit O; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Makal F; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Peterson P; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Alikpala J; FormFactor, Inc., Livermore, California 94551, United States., Nibhanupudi ST; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Luth CJ; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Banerjee SK; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States., Kim M; Department of Electrical and Computer Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, South Korea., Roessler A; Rohde&Schwarz USA, Inc., Columbia, Maryland 21046, United States., Yalon E; Viterbi Faculty of Electrical & Computer Engineering, Technion - Israel Institute of Technology, Haifa 32000, Israel., Akinwande D; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States.
Publikováno v:
Nano letters [Nano Lett] 2023 Feb 22; Vol. 23 (4), pp. 1152-1158. Date of Electronic Publication: 2023 Jan 20.
Conference
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Publikováno v:
Nanomaterials (2079-4991); Apr2024, Vol. 14 Issue 7, p612, 11p