Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Alice C. Kilgo"'
Autor:
Paul. T. Vianco, Alice. C. Kilgo, Bonnie. B. McKenzie, Shelley Williams, Robert Ferrizz, Curtis Co
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:97-112
The performance and reliability were documented for solder joints made between the 96.5Sn-3.0Ag-0.5Cu (wt.%, abbreviated SAC305) Pb-free solder and a Ag-Pd-Pt thick film conductor on an alumina substrate. The Sheppard’s hook pull test was used to a
Autor:
Curtis Co, Bonnie Beth McKenzie, Alice C. Kilgo, Paul T. Vianco, Shelley Williams, Robert Ferrizz
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:81-96
The processibility was document for interconnections made between the 96.5Sn-3.0Ag-0.5Cu (wt.%, abbreviated SAC305) Pb-free solder and an Ag-Pd-Pt thick film conductor on an alumina substrate. The Sheppard’s hook pull test was used to assess the so
Autor:
Celedonio E. Jaramillo, J. Mark Grazier, Alice C. Kilgo, Jerome A. Rejent, Paul T. Vianco, Bonnie Beth McKenzie
Publikováno v:
Journal of Electronic Materials. 49:152-172
This study examined the yield stress and stress–strain deformation of the 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) solder as part of an overall effort to develop a computational model for predicting solder joint reliability. These propert
Autor:
Bradley Howell Jared, Pin Yang, Amy Allen, Lisa Anne Deibler, James J. M. Griego, Alice C. Kilgo, Mark A. Rodriguez, Daniel K. Stefan
Publikováno v:
Journal of Materials Research. 33:1701-1712
The powder-bed laser additive manufacturing (AM) process is widely used in the fabrication of three-dimensional metallic parts with intricate structures, where kinetically controlled diffusion and microstructure ripening can be hindered by fast melti
Publikováno v:
Journal of Electronic Packaging. 140
This study examined the cause of nonwetted regions of the gold (Au) finish on iron-nickel (Fe–Ni) alloy lids that seal ceramic packages using the 80Au-20Sn solder (wt %, abbreviated Au–Sn) and their impact on the final lid-to-ceramic frame solder
Autor:
Gregory N. Nielson, Paul J. Resnick, Jose Luis Cruz-Campa, Murat Okandan, Benjamin B. Yang, Paiboon Tangyunyong, Edward I. Cole, Alice C. Kilgo, Gaddi Haase
Publikováno v:
IEEE Journal of Photovoltaics. 4:470-476
Microsystems-enabled photovoltaics (MEPV) has great potential to meet the increasing demands for light-weight, photovoltaic solutions with high power density and efficiency. This paper describes effective failure analysis techniques to localize and c
Publikováno v:
Materials
Materials, Vol 5, Iss 11, Pp 2151-2175 (2012)
Materials; Volume 5; Issue 11; Pages: 2151-2175
Materials, Vol 5, Iss 11, Pp 2151-2175 (2012)
Materials; Volume 5; Issue 11; Pages: 2151-2175
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest t
Publikováno v:
Journal of Electronic Materials. 39:97-104
The yield-stress behavior was investigated for the 95.5Sn-4.3Ag-0.2Cu (wt.%), 95.5Sn-3.9Ag-0.6Cu, and 95.5Sn-3.8Ag-0.7Cu ternary lead-free solders using the compression stress-strain test technique. Cylindrical specimens were evaluated in the as-cast
Publikováno v:
Journal of Materials Research. 20:1563-1573
The coarsening behavior of the Pb-rich phase particles in 63Sn–37Pb (wt%) solder was investigated following isothermal annealing treatments. Samples were exposed to cooling rates of 0.1, 1.0, 10, and 100 °C/min. Annealing temperatures were 25, 55,
Publikováno v:
Journal of Electronic Materials. 33:1473-1484
Compression creep tests were performed on the 95.5Sn-3.9Ag-0.6Cu (wt.%) solder. The specimens were aged prior to testing at 125°C, 24 h or 150°C, 24 h. Applied stresses were 2–40 MPa. Test temperatures were −25°C to 160°C. The 125°C, 24-h ag