Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Ali Saket"'
Publikováno v:
مسکن و محیط روستا, Vol 35, Iss 153, Pp 47-56 (2016)
Nowadays the architecture of Iran is disordered and disorganized. The attempt to eliminate and prevent the existing crisis and disorder in this era is one of the most important concerns for the contemporary architects. One of the main reasons to this
Externí odkaz:
https://doaj.org/article/4e8636e8141a4628b9834695d4ad39fd
Publikováno v:
IEEE Access, Vol 8, Pp 80827-80835 (2020)
Natural graphite sheet (NGS) is a candidate material for lightweight, high-performance heat sinks. We show that the low through-plane thermal conductivity can be mitigated by using heat pipes. In the measured configuration, the thermal resistance of
Externí odkaz:
https://doaj.org/article/8088f3cd575a4e049099ca993e93793e
Seismotectonics and consequences of the 1930s large earthquakes in eastern Mazandaran, north of Iran
Publikováno v:
Journal of Mountain Science. 19:513-528
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::537c5c5f0831e84ad587ac12086f2dff
https://doi.org/10.1007/s11629-021-6958-1
https://doi.org/10.1007/s11629-021-6958-1
Publikováno v:
IEEE Transactions on Power Electronics. 36:11409-11420
Wide-bandgap and silicon power semiconductor devices require advanced pulsewidth gate-driver capability to successfully convert power for high-performance operation. In this article, a simplified forward isolated resonant converter structure with an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::828109303ed89edbfd4249381abedf03
https://doi.org/10.1109/tpel.2021.3070053
https://doi.org/10.1109/tpel.2021.3070053
Publikováno v:
Journal of Engineering Geology. 14:635-668
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c99855788e7c74b6129e8331009c3590
https://doi.org/10.52547/jeg.14.4.635
https://doi.org/10.52547/jeg.14.4.635
Publikováno v:
IEEE Transactions on Power Electronics. 36:674-682
Compensation capacitors are important components of any resonant wireless power transfer (RWPT) systems and significantly affect the output power, operating frequency, and efficiency. Depending on the compensation network, these capacitors can be pla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a200893596828cd1992bb0c9450839fb
https://doi.org/10.1109/tpel.2020.2998186
https://doi.org/10.1109/tpel.2020.2998186
Publikováno v:
2022 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef0881367420a5b37768df3558a86199
https://doi.org/10.1109/apec43599.2022.9773661
https://doi.org/10.1109/apec43599.2022.9773661
Publikováno v:
IEEE Access, Vol 8, Pp 80827-80835 (2020)
Natural graphite sheet (NGS) is a candidate material for lightweight, high-performance heat sinks. We show that the low through–plane thermal conductivity can be mitigated by using heat pipes. In the measured configuration, the thermal resistance o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f88785064bee321aae74bbab70458b68
https://doi.org/10.1109/access.2020.2988832
https://doi.org/10.1109/access.2020.2988832
Publikováno v:
IEEE Transactions on Power Electronics. 34:11813-11832
With the increasing demand for flat displays, slim telecom/IT power supplies, and portable devices, the use of planar transformers (PTs) is becoming mandatory to achieve slim, compact converter designs. In particular, PTs present a significant opport
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::629b2067107c7f1602aaad6b6b5decfe
https://doi.org/10.1109/tpel.2019.2903168
https://doi.org/10.1109/tpel.2019.2903168
Publikováno v:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
Wide-Bandgap devices are pushing the boundaries of switching frequencies, power densities, and efficiencies of modern power converters. To utilize the full potential of these devices, the parasitic elements formed by the printed circuit board (PCB) l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b161466d6f1847b58a5afaed311d1554
https://doi.org/10.1109/apec42165.2021.9487045
https://doi.org/10.1109/apec42165.2021.9487045