Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Ali Roshanghias"'
Autor:
Johanna Zikulnig, Sean Chang, Jo Bito, Lukas Rauter, Ali Roshanghias, Sandro Carrara, Jürgen Kosel
Publikováno v:
Advanced Sensor Research, Vol 2, Iss 8, Pp n/a-n/a (2023)
Externí odkaz:
https://doaj.org/article/c83e9556fc6a48e69ef8a6cbd7cfb58f
Publikováno v:
Materials, Vol 15, Iss 8, p 2786 (2022)
Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste on wafers. Screen printing of glass frit p
Externí odkaz:
https://doaj.org/article/5abf70ccad844b21996510b393db7ea0
Autor:
Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Publikováno v:
Energies, Vol 14, Iss 8, p 2176 (2021)
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can su
Externí odkaz:
https://doaj.org/article/ff11d3c58a274ca6b76a348c9007705f
Autor:
Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Publikováno v:
Micromachines, Vol 11, Iss 6, p 564 (2020)
Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of red
Externí odkaz:
https://doaj.org/article/88b52fb0314e4200a6db0fa6667f8279
Publikováno v:
Sensors, Vol 20, Iss 8, p 2398 (2020)
With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the pr
Externí odkaz:
https://doaj.org/article/ba15a0592ffd41a99921755967fa33d9
Publikováno v:
Proceedings, Vol 2, Iss 13, p 831 (2018)
The planar fluxgate is an emerging technology feasible for system integration contrary to it’s bulky 3D counterpart. Recently, a novel structure based on an asymmetric double core layout for improved sensitivity and energy efficiency was proposed.
Externí odkaz:
https://doaj.org/article/d1f67319b6d140b4bdd1be748bfeb375
Autor:
Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Publikováno v:
Proceedings, Vol 2, Iss 13, p 703 (2018)
The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs
Externí odkaz:
https://doaj.org/article/020e94b05677404da3644d20fdebc282
Publikováno v:
Proceedings, Vol 1, Iss 4, p 609 (2017)
A rapid advanced packaging concept, consisting of inkjet photopolymer printing and Ag nanoparticles printing, was investigated for the construction of a pressure sensor package. Acrylate-type 3D package housing with 7 through-holes was printed with a
Externí odkaz:
https://doaj.org/article/c2704c739764450d915a6f957ae0a6ee
Publikováno v:
ACS Applied Electronic Materials. 5:2007-2016
Autor:
Sarah Risquez, Sebastian Redolfi, Clement Fleury, Matthias Wulf, Ali Roshanghias, Adrien Piot, Jeremy Streque, Kerstin Schmoltner, Thang Duy Dao, Markus Puff, Mohssen Moridi
Publikováno v:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS).