Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Alfred M. Kriman"'
Publikováno v:
Material Science & Engineering International Journal. 1
Quilt Packaging QP is a new direct interchip interconnect through metal nodules on chip edges We have performed simulations to study the robustness of QP against fatigue failure For quilts on ceramic carriers thermal stresses are driven primarily by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b77f2ece36fad8d129fccf36964438e
https://doi.org/10.15406/mseij.2017.01.00020
https://doi.org/10.15406/mseij.2017.01.00020
Autor:
Gary H. Bernstein, Mohammad Ashraf Khan, Quanling Zheng, Patrick Fay, Alfred M. Kriman, David Kopp
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:400-407
We investigate mechanical, thermal, and microwave characteristics of the edge-interconnect scheme called quilt packaging (QP), using a pin transfer method for the application of solder paste. A novel pull test method for QP is introduced, and the pul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30c4d064318baf969eaf02a6c337b220
https://doi.org/10.1109/tcpmt.2014.2301738
https://doi.org/10.1109/tcpmt.2014.2301738
Autor:
M. Ashraf Khan, Jason M. Kulick, David Kopp, Patrick Fay, Alfred M. Kriman, Gary H. Bernstein
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 10:8-14
Quilt packaging (QP) is a novel high-speed super-connect (i.e., direct interchip interconnect), developed to improve electrical performance—signal delay, power loss, and so on. Ultrahigh bandwidth has already been demonstrated for QP, but its uniqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6760014076f929c542f428da78ccb81
https://doi.org/10.4071/imaps.358
https://doi.org/10.4071/imaps.358
Publikováno v:
International Symposium on Microelectronics. 2012:000524-000530
Quilt Packaging (QP) is a novel high-speed superconnect (i.e. direct interchip interconnect), developed to improve electrical performance — signal delay, power loss, etc. Ultrahigh bandwidth has already been demonstrated for QP, but its unique stru
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::454044f602becc62cabde1f2fde465ec
https://doi.org/10.4071/isom-2012-poster_khan
https://doi.org/10.4071/isom-2012-poster_khan
Publikováno v:
International Symposium on Microelectronics. 2012:000441-000446
Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their vertical surfaces. Based on 3D HFSS simulations,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b6ca96270f66d44ccb3d05896757f8f7
https://doi.org/10.4071/isom-2012-tp55
https://doi.org/10.4071/isom-2012-tp55
Autor:
Quanling Zheng, Patrick Fay, Alfred M. Kriman, Jason M. Kulick, Wayne Buckhanan, Gary H. Bernstein, David Kopp, M. Ashraf Khan
Publikováno v:
Journal of Electronic Packaging. 137
The continued progress of micro-electronics often requires functionality that is spread across multiple chips. This need has led to the development of a variety of alternative chip-packaging technologies that offer increased speed and bandwidth, with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51a98c40d0816e7f1bb1364e9b3565b7
https://doi.org/10.1115/1.4029245
https://doi.org/10.1115/1.4029245
Autor:
Howwen Jou, Alfred M. Kriman
Publikováno v:
Superlattices and Microstructures. 19:203-216
We determine the current distributions in conducting strips whose resistivity and Hall angle vary with longitudinal position along the wire. We consider isolated, finite rectangular Hall bars between semi-infinite leads, as well as periodic structure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b7e1d95a894bcf58b0bf7aaa81a526a
https://doi.org/10.1006/spmi.1996.0024
https://doi.org/10.1006/spmi.1996.0024
Publikováno v:
2010 18th Biennial University/Government/Industry Micro/Nano Symposium.
This paper discusses thermal reliability simulations of Quilt Packaging (QP), a novel chip-to-chip interconnect technology. A simulation model of QP is developed. The issue of reliability arises due to the different coefficients of thermal expansion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98f395b831d036314812224db6792286
https://doi.org/10.1109/ugim.2010.5508910
https://doi.org/10.1109/ugim.2010.5508910
Publikováno v:
Semiconductor Science and Technology. 7:B243-B247
The authors describe a many-body semiclassical approximation for simulating electronic motion. Semiclassical trajectories in this approach are determined from spin-dependent forces and effective mass corrections, which incorporate effects of Heisenbe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7390b931fd9d5eba063d43148a6ea19d
https://doi.org/10.1088/0268-1242/7/3b/058
https://doi.org/10.1088/0268-1242/7/3b/058
Publikováno v:
Journal of Physics: Condensed Matter. 3:6605-6612
The authors report magnetotransport measurements and the quantum Hall effect in lateral surface superlattices, realized in GaAs/AlGaAs high mobility heterojunctions with grid gates. They observe perturbation or destruction of the integer quantum Hall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::984cc28b59faa4844b6b8038cc41092e
https://doi.org/10.1088/0953-8984/3/34/006
https://doi.org/10.1088/0953-8984/3/34/006