Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Alfonso Torres-Jacome"'
Autor:
Abel Garcia-Barrientos, Jose Luis Bernal-Ponce, Jairo Plaza-Castillo, Alberto Cuevas-Salgado, Ariosto Medina-Flores, María Silvia Garcia-Monterrosas, Alfonso Torres-Jacome
Publikováno v:
Materials, Vol 14, Iss 21, p 6349 (2021)
In this paper, the analysis, synthesis and characterization of thin films of a-Si:H deposited by PECVD were carried out. Three types of films were deposited: In the first series (00 process), an intrinsic a-Si:H film was doped. In the second series (
Externí odkaz:
https://doaj.org/article/d8400d8f00844f6c8f163f5031ab8c7c
Autor:
Carlos Roberto Ascencio-Hurtado, Roberto C. Ambrosio Lázaro, Johan Jair Estrada-López, Alfonso Torres Jacome
Publikováno v:
Eng, Vol 4, Iss 2, Pp 1409-1431 (2023)
Energy harvesters are autonomous systems capable of capturing, processing, storing, and utilizing small amounts of free energy from the surrounding environment. Such energy harvesters typically involve three fundamental stages: a micro-generator or e
Externí odkaz:
https://doaj.org/article/b14e0fa6ce8446f9ac81ef93a9584dbc
Autor:
Andres Felipe Jaramillo Alvarado, Francisco Javier De la Hidalga Wade, Pedro Rosales Quintero, Alfonso Torres Jacome
Publikováno v:
Revista Mexicana de Física. 68
The requirements of high quality factor, low power consumption, easy design techniques and compatibility with the main standard fabrication processes of integrated circuits (IC) make the tunable piezoelectric resonators a suitable option for the new
Autor:
Alba Arenas-Hernandez, Carlos Zuniga, Alfonso Torres Jacome, Mario Moreno, Julio Cesar Mendoza-Cervantes, Carlos Roberto Ascencio-Hurtado, Abdu Orduna-Diaz
Publikováno v:
2022 IEEE Latin American Electron Devices Conference (LAEDC).
Autor:
S. V. Koshevaya, Ramon Cabello-Ruiz, Alfonso Torres-Jacome, Margarita Tecpoyotl-Torres, Pedro Vargas-Chable, Gerardo Vera-Dimas
Using Poly-Silicon, the implementation of novel Displacement-amplifying Compliant Mechanisms (DaCM), in two geometries of accelerometers, allows for remarkable improvements in their operation frequency and displacement sensitivity, with different pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74b4deb42b29b0bcdb9f6bef94c45457
https://zenodo.org/record/4063066
https://zenodo.org/record/4063066
Autor:
Wilfrido Calleja Arriaga, Alvarez, Mario Moreno Moreno, Mónico Linares Aranda, Alfonso Torres Jacome, Carlos Ramon Baez Alvarez, Carlos Zuñiga Islas, Joel Molina Reyes
Publikováno v:
Journal of Electronics Cooling and Thermal Control. :97-107
A modular and generic monolithic integrated MEMS process for integrating CMOS technology with polysilicon microstructures is presented. The proposed process flow is designed with an intra CMOS approach to fabricate the microstructures into trenches w
Autor:
Wilfrido Calleja Arriaga, Mónico Linares Aranda, Alfonso Torres Jacome, Carlos Ramon Baez Alvarez
Publikováno v:
CCE
The MEMS (Micro-Electro-Mechanical Systems) acronym recalls mechanical structures of micrometric dimensions performing a well-controlled electronically preset function. The real sense of a microelectromechanical system (MEMS) is the interaction of el
Autor:
Wilfrido Calleja Arriaga, Berni Manolo Perez Ramos, Pedro Rosales Quintero, Carlos Zuñiga Islas, Alfonso Torres Jacome, Joel Molina Reyes
Publikováno v:
Journal of The Electrochemical Society. 160:B201-B206
Autor:
Mónico Linares Aranda, Javier de la Hidalga Wade, Carlos Ramon Baez Alvarez, Alfonso Torres Jacome, Wilfrido Calleja Arriaga
Publikováno v:
CCE
In this work, a set of test structures that meets the emerging need for Micro-Electro-Mechanical Systems (MEMS) integration process monitoring and material/device property measurement at the wafer level is presented. The CMOS-MEMS test structures are
Autor:
Mónico Linares Aranda, Carlos Ramon Baez Alvarez, Alfonso Torres Jacome, Wilfrido Calleja Arriaga
Publikováno v:
SMACD
The design of a set of test structures required to monitoring the residual stress and residual stress gradient in the development of a fabrication process that merges electronic and mechanical devices is presented. The microstructures designed have t