Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Alexandre Blander"'
Autor:
Alexandre Blander, Julien Sylvestre
Publikováno v:
Journal of Electronic Materials. 37:1618-1623
A large number of lead-free Sn-Ag-Cu controlled collapse chip connection (C4) solder joints (∼100 μm in diameter) in flip-chip microelectronic packages were studied by electron backscatter diffraction (EBSD) in order to describe the statistical di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e3f9485cbd16d1ba5df35cf79e1bac6d
https://doi.org/10.1007/s11664-008-0509-1
https://doi.org/10.1007/s11664-008-0509-1
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Detailed observations of the impact of various process parameters on the fracture of brittle structures in low-k dielectric flip chips assembled on organic laminates using lead-free metallurgies are reported. Specifically, a simple model is first pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac1eca5303d0c8241a2c4748788bb5fe
https://doi.org/10.1109/ectc.2008.4549954
https://doi.org/10.1109/ectc.2008.4549954
Publikováno v:
Materials Science Forum; August 2002, Vol. 408 Issue: 1 p1513-1518, 6p